RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA616DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4		260	6.5 mm
U2270B-MFPY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, LOW PROFILE			1.27 mm	105 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.4 mm	3.8 mm	Not Qualified	e3		260	9.9 mm
RN4678APL-V/RM122	Microchip Technology	TELECOM CIRCUIT		NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
L96-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N31		2.5 mm	9.6 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
ESP32-WROVER-B	Espressif Systems (Shanghai)	TELECOM CIRCUIT		NO LEAD	38	DMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		DUAL	150 Mbps	R-XDMA-N38		3.45 mm	18 mm					31.4 mm
BGM113A256V21R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel		-40 Cel		UNSPECIFIED				2 mm	9.15 mm					15.73 mm
BM71BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm		e4			11.5 mm
ESP32-WROVER-IE	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38	DMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		DUAL	150 Mbps	R-XDMA-N38	3	3.45 mm	18 mm				250	31.4 mm
XB3-24Z8CM-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N34			13 mm			NOT SPECIFIED	NOT SPECIFIED	19 mm
BC660K-GL	Quectel Wireless Solutions	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	58	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel		-35 Cel		UNSPECIFIED	.1585 Mbps	R-XXMA-N58		2 mm	15.8 mm					17.7 mm
WL1801MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
BGM113A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N36		2 mm	9.15 mm					15.73 mm
RN4678-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
BT832	Fanstel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N40			14 mm					16 mm
NEO-M9V-20B	U-blox Ag	TELECOM CIRCUIT		NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N24			12.2 mm					16 mm
AP22814BW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G5		1.4 mm	1.6 mm		e3	30	260	3 mm
XB3-24Z8UM	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N34			13 mm					19 mm
NEO-6M-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N24						NOT SPECIFIED	NOT SPECIFIED
WL1835MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
XCC3235MODSF12MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD		R-PQCC-N63		2.45 mm	17.5 mm					20.5 mm
DC-ME4-01T-S-UPW	Digi International	SERIAL DEVICE SERVER		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	100 Mbps	R-XXMA-N		18.67 mm	19.05 mm					36.7 mm
OPA380AIDG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
RN41-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N32		2.2 mm	13.2 mm		e3			25.8 mm
RN4678-V/RM122	Microchip Technology	TELECOM CIRCUIT		NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
AD9832BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
AP22804AW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G5		1.4 mm	1.6 mm		e3	30	260	3 mm
XWL1837MODGIMOC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V		GRID ARRAY			.7 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm					13.4 mm
BQ51013BYFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
BMD-360-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47	3	1.9 mm	9.8 mm				250	14 mm
ST60-SIPT	Laird Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	84	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-30 Cel		UNSPECIFIED	866.7 Mbps	R-XXMA-N84		1.87 mm	13 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
RN4678APL-V/RM120	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
NEO-M8U-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm			NOT SPECIFIED	NOT SPECIFIED	16 mm
BLUENRG-MSCSP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BUTT	34	VFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B34	1	.5 mm	2.56 mm					2.66 mm
HTRC11001T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.01 mA	5 V	3	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14				Not Qualified	e4
CYBT-343026-01	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.22 mm	85 Cel		-30 Cel		UNSPECIFIED		R-XXMA-N24	3	1.95 mm	12 mm					15.5 mm
ETRX357HR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N33			19 mm					25 mm
BGSA14GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel		-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
SIM68M	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N18
BGB707L7ESDE6327XTSA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q101		3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				GOLD PALLADIUM	DUAL		R-PDSO-N7	1	.5 mm	1.3 mm					2 mm
BQ51003YFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
NEO-M8M-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm					16 mm
AP22800HB-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N8		.605 mm	1.6 mm		e4		260	2.1 mm
RN4678APL-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
WT32I-A-AI6-APTX	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N50	3	2.55 mm	15.9 mm			40	260	23.9 mm
MCP2120T-I/SL	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949	.016 mA	5 V	3/5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e3	40	260	8.65 mm
NRF51822-CDAB-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B56	1	.55 mm	3.33 mm					3.5 mm
XB3-24Z8US-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N37						NOT SPECIFIED	NOT SPECIFIED
SA606DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.