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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1120RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
PN5120A0HN1/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified			260	5 mm
XCC2642R1FRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
CC2642R1FRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
SX1509BIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.6 mm	4 mm		e3		260	4 mm
SL3S4011FHK,125	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES								1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N8	1			Not Qualified		30	260
CC2520RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
TLV320AIC3104IRHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	NOT SPECIFIED	260	5 mm
SIM800F	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.0856 Mbps	S-XQMA-N68
PN5120A0HN1/C2,118	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES								1.8/3.3,2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1			Not Qualified			260
SX1272IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	1 mm	6 mm		e3	30	260	6 mm
BGT24LTR11N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-PBCC-B16	1	.77 mm	2.4 mm		e3			2.4 mm
SIM7000G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			30	260	10 mm
ESP32-U4WDH	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,20SQ,14		.35 mm	105 Cel	-40 Cel		QUAD	150 Mbps	S-XQCC-N48		.9 mm	5 mm					5 mm
CLRC66302HN,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
ZOE-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1			AEC-Q100			3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B51	3	1.165 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
ZOE-M8Q-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51	XMA	SQUARE	UNSPECIFIED	YES	1			AEC-Q100			3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N51	3	1.165 mm	4.5 mm					4.5 mm
ISP1507-AX-RS	Insight Sip	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	62	XMA	SQUARE	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N62			8 mm					8 mm
CC2640R2FRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
TLV320AIC3104IRHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	NOT SPECIFIED	260	5 mm
CC2640R2FRSMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N32	3	1 mm	4 mm		e4	30	260	4 mm
TGA2975-SM	Qorvo	TELECOM CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						28 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				QUAD		S-PQCC-N24	3	.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
EQCO62R20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16		1 mm	4 mm		e4			4 mm
SIM7070G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	1.119 Mbps	S-XQMA-N68
CC2500RGP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.25 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
CC2640R2FRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
SIM7000E	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
EQCO62T20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
ANNA-B112-01B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		SQUARE	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N52	3	1.25 mm	6.5 mm					6.5 mm
TCA8418RTWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	.8 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC2640R2FRSMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N32	3	1 mm	4 mm		e4	30	260	4 mm
PN5321A3HN/C106,51	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40	2	1 mm	6 mm				260	6 mm
CC2520RHDRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
OPA380AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1				.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
CC1200RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e4	NOT SPECIFIED	260	5 mm
AFE031AIRGZR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.0053 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
AD9874ABSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
ADAR1000ACCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				-5 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B88	3	.8 mm	7 mm				260	7 mm
SN65DSI84ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm		e1	30	260	5 mm
ADAR1000ACCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				-5 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B88		.8 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
ST7580TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			.03 mA	13 V	13	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
CC2642R1FRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
TRF7970ARHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
ANNA-B112-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52	XMA	SQUARE	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	S-XXMA-N52	3	1.25 mm	6.5 mm					6.5 mm
ISP1507-AC-ST	Insight Sip	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	62	XMA	SQUARE	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N62	3		8 mm			30	260	8 mm
CC2592RGVT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.