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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Carrier Type-2	Carrier Type-1	Width	Qualification	Maximum Output Low Current	Companding Law	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
PSB2115HV1.1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK											QUAD		S-PQFP-G64								Not Qualified
PSF21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel			QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm				10 mm	Not Qualified	4.5 Amp					10 mm
PMB2411V1.1	Infineon Technologies		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR	51.3 mA		2.7/4.5		FLATPACK	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel				-40 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G48								Not Qualified			e0
PSB21373	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK			.8 mm	70 Cel				0 Cel			QUAD		S-PQFP-G44			2.45 mm				10 mm	Not Qualified						10 mm
BGM781N11	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V			SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel				-40 Cel			DUAL		S-PDSO-N11		1	.77 mm				2.5 mm	Not Qualified					225	2.5 mm
PEB8090H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK											QUAD		S-PQFP-G64								Not Qualified
PEB31664	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V			FLATPACK			.8 mm	70 Cel				0 Cel			QUAD		S-PQFP-G64			2.45 mm				14 mm	Not Qualified						14 mm
BGT60	Infineon Technologies	TELECOM CIRCUIT		BALL	119	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY, HEAT SINK/SLUG			.5 mm								BOTTOM		S-PBGA-B119		1	.8 mm				6 mm							6 mm
PMB27251	Infineon Technologies	TELECOM CIRCUIT		GULL WING	128		SQUARE	PLASTIC/EPOXY	YES	1			5 V			FLATPACK											QUAD		S-PQFP-G128								Not Qualified
BGA735N16	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel			QUAD		S-XQCC-N16		1	.4 mm				2.3 mm	Not Qualified						2.3 mm
PEB3465	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3/5,+-5		FLATPACK	QFP80,.68SQ	Codecs	.65 mm	70 Cel				0 Cel	.1 dB	TIN LEAD	QUAD		S-PQFP-G80			2.45 mm	16-BIT			14 mm	Not Qualified		A/MU-LAW	e0			14 mm	YES
PEF8191F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	2.4 V	.45 V	ANSI T1.601	-40 Cel		TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm				10 mm	Not Qualified	7 Amp		e0			10 mm
PSF21150H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel			QUAD	.144 Mbps	S-PQFP-G64	S/T		2.45 mm				14 mm	Not Qualified	4.5 Amp					14 mm
PSB21384	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3/5		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel			QUAD		S-PQFP-G64			2.45 mm				14 mm	Not Qualified						14 mm
PSB2110-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK											QUAD		S-PQFP-G44								Not Qualified
PEF2041N	Infineon Technologies		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel				-40 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44								Not Qualified			e0
PEB31666V1.3	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.125 mA	3.3 V	3.3		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel				-40 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64			2.45 mm				14 mm	Not Qualified			e0			14 mm
PSB21525-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK			.8 mm								QUAD		S-PQFP-G44			2.45 mm				10 mm	Not Qualified						10 mm
PEB55504	Infineon Technologies	TELECOM CIRCUIT		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE, FINE PITCH			.5 mm								QUAD		S-PQFP-G144			1.6 mm				20 mm	Not Qualified						20 mm
PEB2045-NVA3	Infineon Technologies		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel		TIN LEAD	QUAD		S-PQCC-J44		1						Not Qualified			e0		220
BGA735N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		TIN	QUAD		S-XQCC-N16		1	.4 mm				2.3 mm				e3			2.3 mm
BGM781N11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V			SMALL OUTLINE, VERY THIN PROFILE				85 Cel				-40 Cel			DUAL		S-PDSO-N11			.77 mm				2.5 mm					NOT SPECIFIED	NOT SPECIFIED	2.5 mm
PEB2056-N	Infineon Technologies		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44								Not Qualified			e0
PEF22827	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V			GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel				-40 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B225			1.5 mm				13 mm	Not Qualified			e1			13 mm
PEB80900F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel			QUAD		S-PQFP-G64			1.6 mm				10 mm	Not Qualified						10 mm
PSF2115H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK			.8 mm	70 Cel				0 Cel			QUAD		S-PQFP-G64			2.45 mm				14 mm	Not Qualified						14 mm
PMB2900-H	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V			FLATPACK				85 Cel				-25 Cel			QUAD		S-PQFP-G64								Not Qualified
BGT60E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT		BALL	119	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm								BOTTOM		S-PBGA-B119			.8 mm				6 mm							6 mm
PEF2256EV2.2-G	Infineon Technologies		INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS	145 mA		1.8,3.3		GRID ARRAY	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel				-40 Cel			BOTTOM		S-PBGA-B81					T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
PBM99080/22LG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	78	VFLGA	SQUARE	UNSPECIFIED	YES	1			2.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.75 mm	85 Cel				-40 Cel			BOTTOM		S-XBGA-B78			1 mm				8 mm	Not Qualified						8 mm
PEF2256EV2.2	Infineon Technologies		INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS	145 mA		1.8,3.3		GRID ARRAY	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel				-40 Cel			BOTTOM		S-PBGA-B81		3			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified					220
PMB8753	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	65	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B65			.8 mm				5 mm	Not Qualified			e1			5 mm
PEB8191H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel		TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)							Not Qualified	7 Amp		e0
PSB21381	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3/5		FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G44			2.45 mm				10 mm	Not Qualified			e0			10 mm
PSB4860	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK			.65 mm	70 Cel				0 Cel		TIN LEAD	QUAD		S-PQFP-G80			2.45 mm				14 mm	Not Qualified			e0			14 mm
PEB8191F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel		TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm				10 mm	Not Qualified	7 Amp		e0			10 mm
PMB2408	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V			FLATPACK, FINE PITCH			.5 mm	85 Cel				-40 Cel			QUAD		S-PQFP-G48							7 mm	Not Qualified						7 mm
BGM681L11	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	11	DIE	SQUARE	UNSPECIFIED	YES	1			2.8 V			UNCASED CHIP											UPPER		S-XUUC-N11								Not Qualified				NOT SPECIFIED	NOT SPECIFIED
PXB4230	Infineon Technologies	TELECOM CIRCUIT		GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			FLATPACK			.65 mm								QUAD		S-PQFP-G160			2.75 mm				28 mm	Not Qualified						28 mm
PSB7280-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			FLATPACK											QUAD		S-PQFP-G100								Not Qualified
PMB2240V1.6	Infineon Technologies		OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR	29 mA		2.7/4.5		FLATPACK	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel				-30 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G48								Not Qualified			e0
PSF2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel			QUAD		S-PQFP-G64			1.6 mm				10 mm	Not Qualified						10 mm
PEB2055A2N	Infineon Technologies		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44								Not Qualified			e0
PEF2445N-V12	Infineon Technologies		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	20 mA	5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel				-40 Cel			QUAD		S-PQCC-J44								Not Qualified
Q67037-A4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		5 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel				-20 Cel			QUAD		S-PQCC-N48			.9 mm				7 mm	Not Qualified						7 mm
PMB2708_1-F(GOLD-SXH)	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V			FLATPACK											QUAD		S-PQFP-G64								Not Qualified
PEB8090F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE, FINE PITCH			.5 mm								QUAD		S-PQFP-G64			1.6 mm				10 mm	Not Qualified						10 mm
PEB8091H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK											QUAD		S-PQFP-G64								Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.