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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PN5110A0HN1/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1	1 mm	5 mm	Not Qualified		e4			5 mm
CLRC66301HN1/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-25 Cel		QUAD		S-PQCC-N32			1 mm	5 mm	Not Qualified					5 mm
PN5180A0HN/C2,551	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm	6 mm						6 mm
CLRC66301HN1/TRAYBM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-25 Cel		QUAD		S-PQCC-N32			1 mm	5 mm	Not Qualified					5 mm
MFRC52301HN1/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-25 Cel		QUAD		S-PQCC-N32			1 mm	5 mm	Not Qualified					5 mm
MFRC63002HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel				-25 Cel		QUAD	1 Mbps	S-PQCC-N32			1 mm	5 mm						5 mm
MFRC63002HN/TRAYBM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel				-25 Cel		QUAD	1 Mbps	S-PQCC-N32			1 mm	5 mm						5 mm
PN5321A3HN/C101	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm	6 mm	Not Qualified					6 mm
PN5120A0HN/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40		3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
MFRC63001HN/T/R	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel				-25 Cel		QUAD	1 Mbps	S-PQCC-N32			1 mm	5 mm						5 mm
SA636BS	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V			CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel				-40 Cel		QUAD		S-PQCC-N20		1	1 mm	4 mm	Not Qualified					4 mm
PN5120A0ET/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel				-30 Cel		BOTTOM		S-PBGA-B64			1.15 mm	5.5 mm						5.5 mm
MFRC63102HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-25 Cel		QUAD		S-PQCC-N32			1 mm	5 mm						5 mm
PN5110A0HN1/C2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.1 mA	3 V	1.8/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32			1 mm	5 mm	Not Qualified		e3/e4			5 mm
PN5110A0HN1/C2,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1	1 mm	5 mm	Not Qualified		e4			5 mm
MFRC63003HN/T/R	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel				-25 Cel		QUAD	1 Mbps	S-PQCC-N32			1 mm	5 mm						5 mm
MFRC63102HN,157	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel				-25 Cel		QUAD	.4 Mbps	S-PQCC-N32		1	1 mm	5 mm				30	260	5 mm
PN512AA0HN1/C2BI,5	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			AEC-Q100	100 mA		1.8/3.3,2.5/3.3		CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N32					Not Qualified
PN5320A3HN/C101	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm	6 mm	Not Qualified					6 mm
PN512AA0HN1/C2,551	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			AEC-Q100	100 mA		1.8/3.3,2.5/3.3		CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N32		3			Not Qualified				260
HTRC12002B	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3/5		FLATPACK	QFP32,.35SQ,32	Telecom Encryption Circuits	.8 mm							QUAD		S-PQFP-G32					Not Qualified
PN5320A3HN/C1XX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm	6 mm						6 mm
PN512AA0HN1/C2BIY	NXP Semiconductors		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			AEC-Q100	100 mA		3/3.3		CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	90 Cel				-40 Cel		QUAD		S-PQCC-N32					Not Qualified
CLRC66302HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-25 Cel		QUAD		S-PQCC-N32			1 mm	5 mm						5 mm
MFRC63102HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-25 Cel		QUAD		S-PQCC-N32			1 mm	5 mm						5 mm
MFRC63002HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel				-25 Cel		QUAD	1 Mbps	S-PQCC-N32			1 mm	5 mm						5 mm
PMB2240-F	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V			FLATPACK				85 Cel				-30 Cel		QUAD		S-PQFP-G48					Not Qualified
SLE5002W	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44					Not Qualified		e0
PSB2168	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK			.65 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G80			2.45 mm	14 mm	Not Qualified		e0			14 mm
PMB2905-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB7110FV1.0	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V	3.6,5		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified		e0			14 mm
PMB2408V1.1	Infineon Technologies		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		51.3 mA		2.7/4.5		FLATPACK	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G48					Not Qualified		e0
PEF8091H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB21150FV14XQMA1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	MATTE TIN	QUAD		S-PQFP-G64			1.6 mm	10 mm			e3	40	260	10 mm
PSB21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	4.5 Amp				10 mm
PEB31664V1.3	Infineon Technologies		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		BICMOS		125 mA	3.3 V	3.3		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64					Not Qualified		e0
PSB7110FV1.1	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS				3.6,5		FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100					Not Qualified		e0
BGM681L11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	11	DIE	SQUARE	UNSPECIFIED	YES	1				2.8 V			UNCASED CHIP										UPPER		S-XUUC-N11			.65 mm	2.5 mm						2.5 mm
PMB2245-F	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V			FLATPACK				85 Cel				-30 Cel		QUAD		S-PQFP-G48					Not Qualified
PEB31666	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK				85 Cel				-40 Cel		QUAD		S-PQFP-G64					Not Qualified
PMB2708-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PMB27201	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	128		SQUARE	PLASTIC/EPOXY	YES	1				5 V			FLATPACK				85 Cel				-30 Cel		QUAD		S-PQFP-G128					Not Qualified
BGM781N11E6327XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V			SMALL OUTLINE, VERY THIN PROFILE				85 Cel				-40 Cel		DUAL		S-PDSO-N11			.77 mm	2.5 mm						2.5 mm
PEB8191	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB20571	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.275 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
PEF8191H	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	85 Cel	2.4 V	.45 V	ANSI T1.601	-40 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)				Not Qualified	7 Amp	e0
PSB7110FV1.2	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS				3.6,5		FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100					Not Qualified		e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.