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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TDA18250BHN/C1E	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm					260	5 mm
P5DF081HN/T1AD2060,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER				85 Cel	-25 Cel		QUAD		S-PQCC-N32
TFF11094HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm						4 mm
SAA1575	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD		S-PQFP-G100		1.6 mm	14 mm	Not Qualified					14 mm
QN9021	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		.8 mm	5 mm						5 mm
TDA10026HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N64		1 mm	9 mm						9 mm
OL2311AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	3	.85 mm	5 mm						5 mm
TFF11142HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
935264535557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified					28 mm
MWCT1111CLH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	3					e3	40	260
TFF11086HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TZA3044BU/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
TFF11101HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm						4 mm
SA9024	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
MWCT1200CFM	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER				85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N32	3					e3	40	260
TFF11101HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TDA8041H	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.8 mm	70 Cel	0 Cel		QUAD		S-PQFP-G44		2.1 mm	10 mm	Not Qualified					10 mm
P5DF081HN/T1AR1070	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1.5 Mbps	S-PQCC-N32	1	.85 mm	5 mm		ALSO AVAILABLE WITH 5V NOMINAL SUPPLY	e4		260	5 mm
TZA3044U/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
SAA1575-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD		S-PQFP-G100		1.6 mm	14 mm	Not Qualified					14 mm
935266810026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
SJA1105TEL,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B159		1.5 mm	12 mm						12 mm
MRFIC1505AR2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
TFF11115HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified					4 mm
935263381025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TFF11139HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
PCD5071	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		FLATPACK				70 Cel	-25 Cel		QUAD		S-PQFP-G44				Not Qualified
TDA18275HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER					-20 Cel		QUAD		S-PQCC-N32
935266809025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
SA9025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V	3.75	FLATPACK	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD		S-PQFP-G48				Not Qualified		e3
SA58646BD,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	1	1.6 mm	10 mm	Not Qualified		e3			10 mm
PN7150B0HN/C11005Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm						6 mm
SA1630BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
PCF26100ET	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,8X8,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B48		1.12 mm	5 mm	Not Qualified					5 mm
88W9097-B0-NYH2C000	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	114	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.05 V		CHIP CARRIER, HEAT SINK/SLUG	LCC114,.04SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1200 Mbps	S-XQCC-N114		.9 mm	10 mm						10 mm
TZA3040HL	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD		S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm
SLRC61002HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm						5 mm
SL3S1001FTT,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm			e4	30	260	3 mm
TZA3044U	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
OL2385AHN/001A0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm						7 mm
OL2311AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			21.5 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified				260	5 mm
TDA18250BHN/C1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
TFF11086HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
MC71000	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B100		1.35 mm	7 mm						7 mm
MWCT1001AVLHR	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm			e3	40	260	10 mm
TDA18275HN/C1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER					-20 Cel		QUAD		S-PQCC-N32
BTS6201U	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N16		1 mm	3 mm						3 mm
SLRC61002HN/TRAYBM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm						5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.