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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	Additional Features	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STI5300ZUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY								BOTTOM		S-PBGA-B336					Not Qualified
STA311BTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel		-40 Cel		QUAD		S-XQCC-N56		1 mm		8 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
STA9100MGATR	STMicroelectronics	TELECOM CIRCUIT		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32		.8 mm					BOTTOM		S-PBGA-B81		1.7 mm		8 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
MK2180AQ	STMicroelectronics		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			10 mA	5 V		5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			T-1(DS1)		Not Qualified			e0
STV0196	STMicroelectronics		OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES					480 mA	3.3 V		3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64					Not Qualified			e0
STV0288	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm					QUAD		S-PQFP-G64		1.6 mm		10 mm	Not Qualified						10 mm
ST7590	STMicroelectronics		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			30 mA	18 V		18	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N48	3				Not Qualified			e3	40	260
STLC5465B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		5	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G160		4.07 mm		28 mm	Not Qualified			e4			28 mm
STLC60845	STMicroelectronics	TELECOM CIRCUIT		BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V			GRID ARRAY								BOTTOM		S-PBGA-B292					Not Qualified
STA8089GR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.1 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16		.4 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm		7 mm							7 mm
ST70134	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	80 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64		1.6 mm		10 mm	Not Qualified			e4			10 mm
STC1041-F10S	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS				5 V		5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-XQFP-G208					Not Qualified			e0
STA8090EXGAJTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm		9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
L3030	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V	85 mA	5 V	2-4 CONVERSION	+-5	CHIP CARRIER	LDCC44,.7SQ	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 TO 72	0 Cel	TIN LEAD	QUAD		S-PQCC-J44		4.57 mm		16.5862 mm	Not Qualified		CONSTANT CURRENT/RESISTIVE	e0			16.5862 mm
STA8089GRTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.1 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16		.4 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm		7 mm							7 mm
FC106/10	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQFP-G64		2.45 mm		10 mm	Not Qualified			e0			10 mm
STBLC01	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N24		1 mm		5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
STA5620ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL			VQCCN	SQUARE			1	BICMOS				2.7 V						.5 mm	85 Cel		-40 Cel	Tin (Sn)				3	1 mm		5 mm				e3	30	260	5 mm
STA8090EXGAJ	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm		9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
STLC5460	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					5 V		5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD		S-PQCC-J44		4.57 mm		16.5862 mm	Not Qualified			e0			16.5862 mm
STA8090GA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm		8 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
ST7590T	STMicroelectronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			30 mA	18 V		18	FLATPACK	TQFP100,.63SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	QUAD		S-PQFP-G100	3				Not Qualified			e1	30	260
STPAC01F1	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	UNSPECIFIED	YES	1					2.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel		BOTTOM		S-XBGA-B8		.715 mm		1.57 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	1.57 mm
MTC20455PQ-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V		1.8,3.3	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQFP-G160		4.07 mm		28 mm	Not Qualified			e4			28 mm
STA8088G	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm		7 mm							7 mm
SN250Q	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm		7 mm	Not Qualified			e3	40	260	7 mm
STA8088GA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm		7 mm				e3	40	260	7 mm
MTC20454-TQ-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQFP-G100		1.6 mm		14 mm	Not Qualified			e4			14 mm
L3092FNT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-5 V		5 V			CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD		S-PQCC-J28		4.57 mm		11.5062 mm	Not Qualified						11.5062 mm
STA2500DTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V		2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B48	3	1.25 mm		6 mm	Not Qualified			e1	30	260	6 mm
IMSC004-G20M	STMicroelectronics		MILITARY	PIN/PEG	84	PGA	SQUARE	CERAMIC	NO		CMOS				5 V		5	GRID ARRAY	PGA84,10X10	Other Telecom ICs	2.54 mm	125 Cel		-55 Cel	TIN LEAD	PERPENDICULAR		S-XPGA-P84					Not Qualified			e0
STA8090EXGATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm		9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090EXGADTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm		9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
STBLC01QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1					3 V			CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N24		1 mm		5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
STA2500D	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V		2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B48	3	1.25 mm		6 mm	Not Qualified			e1	30	260	6 mm
STA8090GTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm		8 mm							8 mm
STA9100MGA	STMicroelectronics	TELECOM CIRCUIT		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32		.8 mm					BOTTOM		S-PBGA-B81		1.7 mm		8 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
STC104	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS				5 V		5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-XQFP-G208					Not Qualified			e0
M7020R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM		S-PBGA-B272		2.6 mm		27 mm	Not Qualified						27 mm
STPAC01F2	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel		BOTTOM		S-PBGA-B8		.715 mm		1.57 mm	Not Qualified						1.57 mm
STA610	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-XQCC-N64		1 mm		9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
STA264	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES									GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B249					Not Qualified
STA8088TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm		7 mm							7 mm
STA8090EXGA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B169	3	1.2 mm		9 mm				e3		260	9 mm
ST25RU3980-AQFT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel		-40 Cel		QUAD	5 Mbps	S-XQCC-N48		1 mm		7 mm		ESD for RF Pins 5,23,24 is 1C					7 mm
M7040N-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.5 V		1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm		35 mm	Not Qualified			e0			35 mm
STLC1502	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V			FLATPACK, FINE PITCH			.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G208		4.1 mm		28 mm	Not Qualified			e4			28 mm
ST60A2G0C1C7GYO	STMicroelectronics	TELECOM CIRCUIT		BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.45 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.4 mm	105 Cel		-40 Cel		BOTTOM	100 Mbps	S-PBGA-B25		.9 mm		2.2 mm		also operates with 1.8v supply			NOT SPECIFIED	NOT SPECIFIED	2.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.