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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AMIS-49250-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1	.0008 mA	3 V	3,5	CHIP CARRIER	LCC44,.28SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.03125 Mbps	S-XQCC-N44	3	.9 mm	7 mm	Not Qualified	e3	30	260	7 mm
LV0111CF	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B4		.68 mm	1.08 mm					1.08 mm
19699-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
19608-004-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
LA8580W	Onsemi		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			21 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G64				Not Qualified
19608-004-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
AX5031-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3	30	260	4 mm
AX5031-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3		260	4 mm
LC72710W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
AMIS-49200	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1			1		3 V	3,5	FLATPACK	QFP44,.5SQ,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		QUAD	.03125 Mbps	S-PQFP-G44				Not Qualified
AMIS49587C5871RG	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
NB7VQ1006MMNHTBG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified				4 mm
NB7VQ1006MMNTXG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
19699-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
LC72709W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
AX5044-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	.2 Mbps	S-PQCC-N28		1 mm	5 mm					5 mm
AMIS-5300-A	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
AMIS-53000-M	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
AX5043	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N28		.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
AX5042-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.25 Mbps	S-XQCC-N28		1 mm	5 mm		e4			5 mm
LC72709E	Onsemi		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44				Not Qualified
AMIS49587C5871G	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	TIN	QUAD		S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
AMIS49587C5872RG	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD		S-XQCC-N52		1 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
AMIS49587C5872G	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD		S-XQCC-N52		1 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
SX042J	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J68		4.57 mm	24.1808 mm	Not Qualified				24.1808 mm
19637-001-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified				7 mm
FSA9480UCX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B25		.625 mm	2.1 mm					2.1 mm
LC72714W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			20 mA		3/3.3	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
NCV-RSL10-101Q48-AVG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100			1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N48	1	.9 mm	7 mm		e3	30	260	7 mm
FIN212ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm					5 mm
SX042HJ	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J68		4.57 mm	24.1808 mm	Not Qualified				24.1808 mm
LC72708E	Onsemi		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44				Not Qualified
19608-003-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
LV72715PLG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	68	VFLGA	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B68		.85 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
NB7VQ1006MMNG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
NL3HS644BFCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM		S-PBGA-B36		.54 mm	2.34 mm			NOT SPECIFIED	NOT SPECIFIED	2.34 mm
LV2257PTT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm					3 mm
19608-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
LC72711W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
19637-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified				7 mm
19608-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
NCV7428MW3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7428MWL5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7428MWL3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
M7010R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STA8088ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm					7 mm
STHVDAC-253MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B16		.64 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
STI5300AUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B336				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.