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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD73322LAST-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	85 Cel	-40 Cel	.75 dB	TIN LEAD	QUAD	S-PQFP-G44	3	1.6 mm	16-BIT	14 mm	Not Qualified	e0		240	14 mm	YES
HMC8200LP5METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	1 mm		5 mm		e4		260	5 mm
AD9857ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE	QFP80,.64SQ	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm		14 mm	Not Qualified	e3	40	260	14 mm
ADN2928	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	0 Cel		TIN LEAD	BOTTOM	S-PBGA-B49		1.7 mm		6 mm	Not Qualified	e0			6 mm
ADF7023-JBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.8 mm		5 mm	Not Qualified	e4	30	260	5 mm
AD9853	Analog Devices		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		181 mA	3.3 V	3.3	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G44					Not Qualified	e0
AD9863BCPRL-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
AD9832-KGD-CHIPS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	DIE	SQUARE	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel			UPPER	S-XUUC-N20		.28 mm		2.6 mm			NOT SPECIFIED	NOT SPECIFIED	2.6 mm
ADN2890XCP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD OVER SILVER	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
LTC5100EUF#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQCC-N16	1	.8 mm		4 mm	Not Qualified	e0			4 mm
AD9865BCP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
AD8316ARM-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		TIN LEAD	DUAL	S-PDSO-G10		1.1 mm		3 mm	Not Qualified	e0			3 mm
HMC662LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	1 mm		3 mm		e3	30	260	3 mm
AD9875BSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e3			7 mm
LTC5593IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
AD9874BST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.0265 mA	3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e0			7 mm
AD9856ASTRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e0			7 mm
HMC5846LS6	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1				7 V		CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel	-55 Cel			QUAD	S-XQCC-N16	3	1.09 mm		6 mm				260	6 mm
ADF7030BCPZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N40	3	.8 mm		6 mm	Not Qualified		30	260	6 mm
AD8316ACP-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.012 mA	2.7 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		TIN LEAD	QUAD	S-XQCC-N16		1 mm		4 mm	Not Qualified	e0			4 mm
AD73322LYST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	105 Cel	-40 Cel	.75 dB	TIN LEAD	QUAD	S-PQFP-G44		1.6 mm	16-BIT	14 mm	Not Qualified	e0			14 mm	YES
AD73360AS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK				85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G44					Not Qualified	e0
HMC862LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	1 mm		3 mm		e3		260	3 mm
AD9874	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e0			7 mm
ADN2830ACP-32-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified	e0			5 mm
AD9856AST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.53 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified	e0		240	7 mm
AD9868BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.475 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		1 mm		9 mm	Not Qualified	e3			9 mm
AD73322LYST-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	105 Cel	-40 Cel	.75 dB	TIN LEAD	QUAD	S-PQFP-G44	3	1.6 mm	16-BIT	14 mm	Not Qualified	e0		240	14 mm	YES
HMC697LP4RTR	Analog Devices		INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES					5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N24					Not Qualified
ADF7030-1BCPZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N40	3	.8 mm		6 mm			30	260	6 mm
HMC551LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	1 mm		4 mm	Not Qualified	e3			4 mm
ADN2913ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	3	1 mm		4 mm		e3		260	4 mm
ADN2892ACP-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		TIN LEAD OVER SILVER	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
AD8316ACP-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.012 mA	2.7 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel			QUAD	S-XQCC-N16		1 mm		4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ADN2891ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
AD73322LASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE			1 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G44	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
AD8316ARM	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		TIN LEAD	DUAL	S-PDSO-G10		1.1 mm		3 mm	Not Qualified	e0			3 mm
LTC5593IUH#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
AD9866BCPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
AD9878BSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
HMC551LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQCC-N24	1	1 mm		4 mm	Not Qualified	e0			4 mm
HMC8108LC5TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N32	3	1.12 mm		4.9 mm			30	260	4.9 mm
AD8316ARM-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		TIN LEAD	DUAL	S-PDSO-G10		1.1 mm		3 mm	Not Qualified	e0			3 mm
AD9868BCPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.475 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		1 mm		9 mm	Not Qualified	e3			9 mm
AD9816JS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		FLATPACK			.8 mm	70 Cel	0 Cel			QUAD	S-PQFP-G44		2.45 mm		10 mm	Not Qualified				10 mm
HMC678LC3CTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1		-3.3 V				CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			QUAD	S-CQCC-N16	3	1.31 mm		3 mm			30	260	3 mm
AD9354	Analog Devices	TELECOM CIRCUIT		NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER								QUAD	S-XQCC-N56					Not Qualified
AD9853AS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.23 mA	3.3 V	3.3	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G44		2.45 mm		10 mm	Not Qualified	e0	30	220	10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.