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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC748LC3C	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3	1.31 mm	3 mm	Not Qualified		e4	30	260	3 mm
AD6679BBPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.49 mm	12 mm				30	260	12 mm
LTC1758-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1757-2CMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	70 Cel	0 Cel		DUAL	S-PDSO-G10	1	1.17 mm	3 mm		SEATED HT-CALCULATED			245	3 mm
AD6426XST	Analog Devices		OTHER	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			2.4/3.3	FLATPACK	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G144				Not Qualified		e0
AD6620	Analog Devices	TELECOM CIRCUIT		GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD	S-PQFP-G80				Not Qualified			30	220
HMC738LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm			e3	30	260	4 mm
HMC310MS8GTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm						3 mm
AD6623ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
ADA4961ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm
LTC4403-2EMS#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
ADL5246ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.8 mm	5 mm			e4	30	260	5 mm
AD6422AST	Analog Devices	TELECOM CIRCUIT		GULL WING	144	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G144		1.6 mm	20 mm	Not Qualified					20 mm
LTC1757A-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.17 mm	3 mm	Not Qualified		e0			3 mm
AD6122ACPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified		e0			5 mm
ADL5354ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	1 mm	6 mm	Not Qualified		e3			6 mm
ADP5585ACPZ-03-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	.8 mm	3 mm			e3	30	260	3 mm
LTC1957-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
ADL5335ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.8 mm	4 mm			e4	30	260	4 mm
ADRF6820ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40		.8 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
AD6674BCPZRL7-750	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
HMC737LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e0			4 mm
AD6652BBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified		e0		240	17 mm
AD9993BBCZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.4 mm	12 mm				30	260	12 mm
HMC736LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24		1 mm	4 mm						4 mm
FIDO2100PLQ128IR0	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
ADP5585ACPZ-00-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	.8 mm	3 mm			e3	30	260	3 mm
LTC1758-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
HMC496LP3	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16	1	1 mm	3 mm	Not Qualified		e0		235	3 mm
LTC1758-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
AD6426XB	Analog Devices		OTHER	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			2.4/3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	BOTTOM	S-PBGA-B144				Not Qualified		e0
AD6121ACPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32		1 mm	5 mm	Not Qualified		e0			5 mm
ADL5353ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	.9 mm	5 mm	Not Qualified		e3			5 mm
HMC736LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e0			4 mm
ADRF5519BCPZN-R7	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N40	3	1 mm	6 mm				30	260	6 mm
ADL5605ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
AD8151	Analog Devices		OTHER	GULL WING	184	QFP	SQUARE	PLASTIC/EPOXY	YES					+-3.3/+-5	FLATPACK	QFP184,.87SQ,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G184				Not Qualified		e0
ADF5709BEZ-R7	Analog Devices	TELECOM CIRCUIT		NO LEAD	24	QCCN	SQUARE	CERAMIC	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-CQCC-N24		1.2 mm	3.9 mm						3.9 mm
ADF5904WCCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm			e3	30	260	5 mm
HMC738LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-XQCC-N24	1	1 mm	4 mm	Not Qualified		e0			4 mm
AD53/009-9	Analog Devices	TELECOM CIRCUIT		GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE			.65 mm			TIN LEAD	QUAD	S-PQFP-G80		1.6 mm	14 mm	Not Qualified		e0			14 mm
HMC775LC5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N32	3	1.12 mm	5 mm	Not Qualified		e4		260	5 mm
HMC700LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e3		260	4 mm
LTC4403-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
AD9957BSVZ-REEL13	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	UNSPECIFIED	YES	1			1.8 V	1.8,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQFP-G48	3	1.2 mm	14 mm	Not Qualified		e3		260	14 mm
HMC736LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N24	1	1 mm	4 mm			e3	30	260	4 mm
LT5557EUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF5904ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm			e3	30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.