SQUARE Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

MAX3276UGE

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

16

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.099 mA

3.3 V

3.3

CHIP CARRIER, VERY THIN PROFILE

LCC16,.16SQ,25

ATM/SONET/SDH ICs

.65 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-N16

1 mm

4 mm

Not Qualified

e0

4 mm

78P2344JAT-IEL/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3804ETE+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N16

1

.8 mm

3 mm

e3

30

260

3 mm

DS2153Q-A7/TR+

Analog Devices

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-J44

CEPT PCM-30/E-1

Not Qualified

e3

PHY1078-01-QT-RR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

5 mm

78P2342JAT-IGT/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

196 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3983UGK+TD

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.58 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e3

30

260

10 mm

DS3131+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B272

2.34 mm

27 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

27 mm

78P2343-IEL/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342JAT-IGT/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

196 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342-IGT/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

187 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343JAT-IGT/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3657EGG

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N12

.9 mm

3 mm

Not Qualified

e0

3 mm

78P2343JAT-IEL/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343JAT-IGT/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3983UGK-T

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N68

.9 mm

10 mm

Not Qualified

e0

10 mm

78P2343-IGT/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

PHY1078-01QT-BR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

78P2343-IGT/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343JAT-IGT/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343JAT-IEL/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343JAT-IEL/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343-IGT/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342-IGT/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

187 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3519ETP+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N20

1

.8 mm

5 mm

e3

30

260

5 mm

78P2344JAT-IEL/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342-IGT/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

187 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3799ETJ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

SC1905A-00A00E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N64

.9 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

MAX3753CCM

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

.353 mA

3.3 V

3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e0

7 mm

78P2343-IEL/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3120CUA+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3946ETG+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3964AETP+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.045 mA

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

AD6624ABC

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

2.5,3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B196

1.5 mm

15 mm

Not Qualified

e0

15 mm

LTC1758-2EMS#TR

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LTC1957-2EMS#TRPBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

LTC4400-2EMS8#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

AD9082BBPZ-4D2AC

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, FINE PITCH

BGA324,18X18,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

3

1.72 mm

15 mm

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

30

260

15 mm

HMC917LP3ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

1 mm

3 mm

260

3 mm

V62/12649-01XE

Analog Devices

OTHER

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

105 Cel

-55 Cel

QUAD

S-PQCC-N24

LTC4401-2EMS8#TR

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

AD6122ACP

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

e0

5 mm

HMC773LC3BTR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N12

3

.92 mm

3 mm

Not Qualified

e4

260

3 mm

ADF5904WCCPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

LTC4402-1EMS8#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

ADP5589ACPZ-02-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

3.5 mm

e3

30

260

3.5 mm

ADSP-21MOD980N-000

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.9 V

1.9,3.3

GRID ARRAY

BGA352,26X26,50

Modems

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B352

2.62 mm

35 mm

Not Qualified

e0

35 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.