SQUARE Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

LTC4403-2EMS#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LT1328CMS8#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

AD6684BCPZRL7-500

Analog Devices

TELECOM CIRCUIT

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.975 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

MATTE TIN

QUAD

S-XQCC-N72

3

1 mm

10 mm

e3

30

260

10 mm

ADP5585ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.545 mm

1.59 mm

e1

30

260

1.59 mm

ADL5353ACPZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

5 mm

Not Qualified

e3

5 mm

AD8283WBCPZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

.19 mA

1.8 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC72,.39SQ,20

ATM/SONET/SDH ICs

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N72

3

.9 mm

10 mm

Not Qualified

e3

30

260

10 mm

ADP5589ACPZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

3.5 mm

e3

30

260

3.5 mm

MAX3754CCM-T

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

78P2344-IEL/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342JAT-IGT/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

196 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

DS2180Q

Analog Devices

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J44

T-1(DS1)

Not Qualified

e0

PHY1070-01QD-RR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

S-XQCC-N36

1

.95 mm

6 mm

30

260

6 mm

SC1905A-00A00

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N64

.9 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

78P2344JAT-IEL/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342-IGT/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

187 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343JAT-IEL/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

PHY1040-01QS-RE

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.95 mm

5 mm

5 mm

78P2343-IGT/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3120CUA+T

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

78P2344JAT-IGT/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

DS2153QN-A7/TR+

Analog Devices

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-J44

CEPT PCM-30/E-1

Not Qualified

e3

78P2344-IGT/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

DS2172T/T&R+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK, THIN PROFILE

.8 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

7 mm

MAX3658AETA+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

.026 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3799ETJ+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3983UGK+D

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.58 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e3

30

260

10 mm

78P2344-IGT/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2343-IEL/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3120EUA+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3983UGK

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.58 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N68

.9 mm

10 mm

Not Qualified

e0

10 mm

78P2344-IEL/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2342JAT-IGT/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

196 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

SC2200A-00A00

Analog Devices

TELECOM CIRCUIT

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N80

.9 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

78P2344-IGT/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2344JAT-IGT/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2344-IGT/A07

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2344JAT-IEL/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

SC2200A-00A00E

Analog Devices

TELECOM CIRCUIT

NO LEAD

80

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N80

.9 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

78P2343-IEL/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3804ETE+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

78P2343JAT-IGT/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2344-IEL/A07R

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

MAX3518ETP+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N20

1

.8 mm

5 mm

e3

30

260

5 mm

78P2344-IEL/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

355 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2344JAT-IGT/A07R/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

78P2344JAT-IGT/A07/F

Analog Devices

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

380 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

T-3(DS3)

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

STS-1/OC-1

E-3

Not Qualified

PHY2078QT-RR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX3983UGK+

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.58 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e3

30

260

10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.