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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX1385AETM+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.0043 mA	5 V	3/5,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
MAX7030HATJ-T	Analog Devices		AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		20.4 mA		2.5/5	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N32				Not Qualified	e0
MAX7032ATJ-T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		20.4 mA	2.7 V	2.7	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N32				Not Qualified	e0
MAX2181ETE/V	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
MAX7365EWA76+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B25		.69 mm	2.065 mm			NOT SPECIFIED	NOT SPECIFIED	2.065 mm
MAX2031ETP	Analog Devices		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES		BICMOS		100 mA	5 V	5	CHIP CARRIER	LCC20,.20SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N20				Not Qualified	e0
MAX2670GTB/V+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm		e3	30	260	3 mm
MAX7365EWA74+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B25		.69 mm	2.065 mm			NOT SPECIFIED	NOT SPECIFIED	2.065 mm
MAX7032ATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0204 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7030HATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX19713ETN+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0306 mA	3 V	1.8/3.3,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N56	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX19985AETX+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX7031MATJ15-T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32		.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2181AETE/V+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm		e3	30	260	3 mm
MAX2023ETX+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.345 mA	5 V	5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX7036GTP+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm		e3	30	260	5 mm
MAX1471ATJ/V+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
MAX2694EWS+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B4	1	.69 mm	.84 mm		e2	30	260	.84 mm
MAX7036GTP/V+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100	.0074 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX1471ATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7365EWA70+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B25	1	.69 mm	2.065 mm		e2	30	260	2.065 mm
MAX2850ITK+T	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N68	3	.8 mm	10 mm		e3	30	260	10 mm
MAX2850ITK+	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N68	3	.8 mm	10 mm	Not Qualified	e3	30	260	10 mm
MAX7030LATJ-T	Analog Devices		AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		20.4 mA		2.5/5	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N32				Not Qualified	e0
MAX1471ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2670GTB+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm		e3	30	260	3 mm
MAX14984ETG+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm		e3	30	260	4 mm
MAX7033ETJ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.00688 mA	3.3 V	3.3/5	CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7031MATJ50	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX1479ATE+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0181 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX1479ATE+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0181 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX2670GTB/V+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	2				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX19985AETX+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX2181AETE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm		e3	30	260	3 mm
MAX7031MATJ15+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified				5 mm
MAX7042ATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0092 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2121ETI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
MAX7032ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0204 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2670GTB+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	2				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX19707ETM+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.035 mA	3 V	1.8/3.3,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX7036GTP/V+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm		e3	30	260	5 mm
MAX14617ETA+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N8	1	.8 mm	2 mm		e3	30	260	2 mm
MAX7031MATJ15	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7031LATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX19707ETM+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.035 mA	3 V	1.8/3.3,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX19996ETP+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX2181AETE+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm		e3	30	260	3 mm
MAX7042ATJ/V+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.