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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STA240	STMicroelectronics		INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS					1.2,3.3	GRID ARRAY	BGA288,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B288					Not Qualified
STA5620TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			.019 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MK50H27Q33	STMicroelectronics		COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS				5 V	5	CHIP CARRIER	LDCC52,.8SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J52					Not Qualified	e3
STB3300	STMicroelectronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				.06 mA	5 V	5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm		7 mm	Not Qualified	e0			7 mm
M7020R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
STA2500DC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B48		1.25 mm		6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
M7020R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B144					Not Qualified
STLC1502P	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	HCMOS				2.5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm		28 mm	Not Qualified				28 mm
FC106	STMicroelectronics		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS				3.3 V	3.3	FLATPACK	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G64					Not Qualified	e0
M7040N-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm		35 mm	Not Qualified	e0			35 mm
E-STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B676	3				Not Qualified	e1
STB6100T	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER			.5 mm			Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	3	1 mm		5 mm	Not Qualified	e3	30	260	5 mm
STLC5432Q	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V	5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G44		1.6 mm	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
SN250QT	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm		7 mm	Not Qualified	e3	40	260	7 mm
STA5630ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32		1 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
MTC20136MB-I1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.7 mm		12 mm	Not Qualified	e1			12 mm
STA8090EXGAD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm		9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STA264TR	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B249					Not Qualified
STA8090EXGAJD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm		9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STB5701TR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
M7020R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
STB5701	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
STM7E1AR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			-3.3 V		3.3 V	+-3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm		10 mm	Not Qualified	e4	30	260	10 mm
E-STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B676	3				Not Qualified	e1
FC106/14	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V	3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		2.35 mm		14 mm	Not Qualified	e0			14 mm
ST952	STMicroelectronics		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		HYBRID						FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G32					Not Qualified	e0
STW3101	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES						2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B104					Not Qualified
E-STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B120		1.4 mm		10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
STA8088GTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm		7 mm					7 mm
M7010R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
M7010R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
ST75C530	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				150 mA	5 V		FLATPACK, LOW PROFILE			.65 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.6 mm		14 mm	Not Qualified				14 mm
STA8088GA5	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm		8 mm					8 mm
STRADA431-TR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	40		SQUARE	UNSPECIFIED	YES	1		AEC-Q100			3.3 V			LCC40,.24SQ,20						QUAD	S-XQCC-N40				6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STLC5466	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G176		1.6 mm		24 mm	Not Qualified	e4			24 mm
STA5630TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Silver (Ag)	QUAD	S-XQCC-N32	3	1 mm		5 mm		e4	30	260	5 mm
L3092TFN	STMicroelectronics		INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J28					Not Qualified	e0
STB6100	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER			.5 mm			Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	3	1 mm		5 mm	Not Qualified	e3	30	260	5 mm
STA5620CTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL			VQCCN	SQUARE			1	BICMOS				2.7 V					.5 mm	85 Cel	-40 Cel	TIN			3	1 mm		5 mm		e3	30	260	5 mm
STA8088A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm		7 mm					7 mm
STLC2411	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B132		1.2 mm		8 mm	Not Qualified	e0			8 mm
STLC1512	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e4			7 mm
STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B676					Not Qualified
STV0360	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G64		1.6 mm		10 mm	Not Qualified				10 mm
M7020R-050ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
STV0297E	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm		10 mm	Not Qualified	e4	30	260	10 mm
M7040N-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm		35 mm	Not Qualified	e0			35 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.