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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA1630BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
OL2300NHN/F,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				19 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
TFF11115HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
OM5926HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20		1 mm	5 mm	Not Qualified	e3/e4			5 mm
PCF5079HK/C/1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.01 mA	3.6 V	2.5/5	SMALL OUTLINE	SOLCC10,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-N10				Not Qualified
935262698026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1					3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
SL3S1202FTT,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		30	260	3 mm
MRFIC1505R2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
PN7150B0HN/C11004E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
TFF11145HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
PCA5007H/XXX	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.2 V		FLATPACK				55 Cel	-10 Cel	TIN	QUAD		S-PQFP-G48				Not Qualified	e3
VES1848	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		S-PQFP-G208				Not Qualified
PRH601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD		S-PQFP-G100		1.6 mm	14 mm					14 mm
SAA1575HL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G100		1.6 mm	14 mm	Not Qualified	e3			14 mm
OL2385AHN/001B0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
TEF6657HN/V101,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-PQCC-N32
PCD5071-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V		FLATPACK				70 Cel	-25 Cel		QUAD		S-PQFP-G44				Not Qualified
TFF11145HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
QN9020	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		.8 mm	6 mm					6 mm
SA9025BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
MC33596FCER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm
MC33596FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33696FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MKW20Z160VHT4	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER				85 Cel	-40 Cel	NICKEL GOLD	QUAD		S-XQCC-N48	3				e4	40	260
HTMS1301FUG/AM	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	5		SQUARE	UNSPECIFIED	YES								UNCASED CHIP							UPPER		S-XUUC-N5				Not Qualified
MKW40Z160VHT4	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER				85 Cel	-40 Cel	NICKEL GOLD	QUAD		S-XQCC-N48	3				e4	40	260
MC33MR2001VVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	90	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B90	3	1.02 mm	6 mm		e1	40	260	6 mm
MC33696FCAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			40	260	5 mm
935297333118	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MKW20Z160VHT4R	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N48
MC33742PEP	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES				1	.045 mA		5.5/18	CHIP CARRIER	LCC48,.27SQ,20	Network Interfaces	.5 mm	125 Cel	-40 Cel	TIN	QUAD	1 Mbps	S-PQCC-N48	3			Not Qualified	e3	40	260
MC33596FCAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm			40	260	5 mm
MMDS25254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20		.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
MC33696FCAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			40	260	5 mm
MC33596FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MC33696FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC12311CHNR	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	LGA	SQUARE	PLASTIC/EPOXY	YES							2/3.3	GRID ARRAY	LGA60,16X16,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-PBGA-N60	3			Not Qualified	e4	40	260
MC33596FCE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			40	260	5 mm
MC33696FCE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm			40	260	5 mm
935297333157	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
HTMS8301FUG/AM	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	5		SQUARE	UNSPECIFIED	YES								UNCASED CHIP							UPPER		S-XUUC-N5				Not Qualified
MC33696FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
HTMS1301FUG/AM,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	SQUARE	UNSPECIFIED	YES	1	CMOS						UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N
MC12311	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	60	VFLGA	SQUARE	UNSPECIFIED	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B60		.98 mm	8 mm					8 mm
MMDS09254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20		.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
935297333151	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MC33596FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33696FCER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.