SQUARE Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

DELIC-PB

Infineon Technologies

COMMERCIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

275 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G100

Not Qualified

e0

BGT60E6327

Infineon Technologies

TELECOM CIRCUIT

BALL

119

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

BOTTOM

S-PBGA-B119

.8 mm

6 mm

6 mm

PBM99080/22MG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

78

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY, FINE PITCH

.75 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B78

8 mm

Not Qualified

8 mm

DELIC-LC

Infineon Technologies

COMMERCIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

275 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G100

Not Qualified

e0

PEF20954

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G144

1.6 mm

20 mm

Not Qualified

e0

20 mm

PEF22624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PMB2705-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-25 Cel

QUAD

S-PQFP-G176

Not Qualified

PSB2113H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.019 mA

5 V

5

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

e0

14 mm

PMB2247-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

PBA31305

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

36

LLGA

SQUARE

UNSPECIFIED

YES

1

CMOS

2.6 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-20 Cel

BOTTOM

S-XBGA-B36

1.6 mm

8.8 mm

Not Qualified

8.8 mm

BGSX44MA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B12

1

.65 mm

1.6 mm

1.6 mm

PEF21624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PEF8191

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

BGT24LTR11N16

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

16

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBCC-B16

1

.77 mm

2.4 mm

2.4 mm

PMB2407-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

PEF24624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PEB2041N

Infineon Technologies

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

Not Qualified

e0

PSB2115F-V12

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

PEF2075-N

Infineon Technologies

TELECOM CIRCUIT

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER

1.27 mm

QUAD

S-PQCC-J44

4.57 mm

16.6 mm

Not Qualified

16.6 mm

PSB21150HV1.4

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

3

2.45 mm

14 mm

220

14 mm

PBM99090

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

96

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B96

Not Qualified

BGA123L4E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

VQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-N4

1

.32 mm

.7 mm

.7 mm

PMB2707-F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

14 mm

PSB2110-N

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

4.5 V

.45 V

CCITT I.411

0 Cel

TIN LEAD

QUAD

.064 Mbps

S-PQCC-J44

R

4.68 mm

16.7 mm

Not Qualified

7 Amp

e0

16.7 mm

PEB22521F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

14 mm

PEB31665

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PBM99080/32MG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

78

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B78

Not Qualified

PSB21150H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

BASIC

FLATPACK

QFP64,.66SQ,32

Digital Transmission Interfaces

.8 mm

70 Cel

2.4 V

.45 V

CCITT I.430

0 Cel

QUAD

.144 Mbps

S-PQFP-G64

S/T

2.45 mm

14 mm

Not Qualified

4.5 Amp

14 mm

PSB21150FV14XQSA1

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

PBM99080/32LG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

78

VFLGA

SQUARE

UNSPECIFIED

YES

1

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B78

1 mm

8 mm

Not Qualified

8 mm

PSF2115

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

PMB2708_2-F(GOLD-SXE)

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

PEB20570

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.275 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

14 mm

PSB21393

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

PSB7115FV2.1

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G144

1.6 mm

20 mm

Not Qualified

20 mm

PEB31665V1.0

Infineon Technologies

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G44

Not Qualified

e0

PSB21391

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

PEB8091F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

PEF22817

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B225

1.5 mm

13 mm

Not Qualified

13 mm

PEB80900H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PEB2045A-2N

Infineon Technologies

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

Not Qualified

e0

NWX1900P

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

3

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-30 Cel

QUAD

S-PQCC-N3

1.22 mm

3.8 mm

Not Qualified

3.8 mm

PMB27202

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

128

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G128

Not Qualified

PSB2115

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PSB21383HV1.3

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

3

2.45 mm

10 mm

260

10 mm

PSB2113F

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.019 mA

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e0

10 mm

PEF24624EV2.2-G

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PMB27252

Infineon Technologies

TELECOM CIRCUIT

GULL WING

128

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

QUAD

S-PQFP-G128

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.