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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TEF6657HN/V101	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-PQCC-N32
TFF11094HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
SA1620BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TFF11092HN/N1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
SL3S1002FTT,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		30	260	3 mm
TZA3044BU/T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
PR601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD		S-PQFP-G100		1.6 mm	14 mm					14 mm
OL2300NHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N16		1 mm	3 mm	Not Qualified				3 mm
PT5010A0HN/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
TDA10025HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
SA58646BD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD		S-PQFP-G64	1	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
TFF11142HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
CD8404BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			4.8 V	4.8	FLATPACK	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48				Not Qualified
BGX7221HN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N36		1 mm	6 mm					6 mm
TDA18250BHN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
TDA18250BHN/C1Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm				260	5 mm
PCA5010H/XXX	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.2 V		FLATPACK				55 Cel	-10 Cel		QUAD		S-PQFP-G48				Not Qualified
BGX7221HN/1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N36	3	1 mm	6 mm				260	6 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm					10 mm
TFF11092HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	1 mm	4 mm		e4	30	260	4 mm
BGX7100HN/1,115	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES					5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
TFF11142HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
PN5441A2ET/C20501	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY				85 Cel	-25 Cel		BOTTOM		S-PBGA-B64
OL2381AHN/C0CZ	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		.85 mm	5 mm					5 mm
P5DF081HN/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32					e4
PN7150B0HN/C11005E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
SL3S1202FTT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE			.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified				3 mm
OL2385AHN/001C0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
UAA3559HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified	e3/e4			5 mm
PCF50732H	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.5 V	2.7	FLATPACK	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD		S-PQFP-G48				Not Qualified	e3
TFF11101HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
OL2385AHN/00100	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
QN9022	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	5 mm					5 mm
TFF11115HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
UAA3558HN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		CHIP CARRIER				50 Cel	-10 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32				Not Qualified	e3/e4
SLRC61002HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
TZA3044U/T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
TFF11086HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
TFF1007HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
QN9080DHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		1 mm	6 mm					6 mm
BGX7100HN/1,118	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES					5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
935408659518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
PCF87852E	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA73,12X12,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B73		1.3 mm	7 mm	Not Qualified		40	260	7 mm
SA1620BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
P51XASCCB	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK							QUAD		S-PQFP-G100				Not Qualified
UAA3558HL	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	FLATPACK	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	50 Cel	-10 Cel	TIN	QUAD		S-PQFP-G32				Not Qualified	e3
TFF11094HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified				4 mm
PCF5079T/C/1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	3.6 V	2.5/5	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G10				Not Qualified	e4

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.