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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
ADF7030-1BSTZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm		7 mm		e3	30	260	7 mm
ADN2890ACP-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		Tin/Lead (Sn85Pb15) - with Silver (Ag) barrier	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
AD9861BCPRL-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
HMC680LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N24		1 mm		4 mm					4 mm
AD73322ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE			1 mm	85 Cel	-40 Cel		TIN	QUAD	S-PQFP-G44	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
ADF7241BCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	3	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
HMC571LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel		GOLD OVER NICKEL	QUAD	S-XQCC-N32	3	1.12 mm		5 mm	Not Qualified	e4		260	5 mm
AD9863BCPZ-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
HMC625ALP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32		1 mm		5 mm		e3			5 mm
HMC680LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N24		1 mm		4 mm					4 mm
ADN2891ACP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.06 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		TIN LEAD OVER SILVER	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
AD73322LYSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE			1 mm	105 Cel	-40 Cel		TIN	QUAD	S-PQFP-G44	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
ADN2917ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	3	1 mm		4 mm		e3			4 mm
HMC1030LP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	1	1 mm		5 mm		e3			5 mm
AD73322LYSTZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE			1 mm	105 Cel	-40 Cel		TIN	QUAD	S-PQFP-G44	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
HMC8108LC5TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N32	3	1.12 mm		4.9 mm			30	260	4.9 mm
ADN2890ACP-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
AD73322LAST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	85 Cel	-40 Cel	.75 dB	TIN LEAD	QUAD	S-PQFP-G44	3	1.6 mm	16-BIT	14 mm	Not Qualified	e0		240	14 mm	YES
AD9878BSTRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G100		1.6 mm		14 mm	Not Qualified	e0			14 mm
LTC5100EUF#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm		4 mm	Not Qualified	e3	30	260	4 mm
AD9875BSTRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.288 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified	e0		240	7 mm
AD9816JSRL	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		FLATPACK			.8 mm	70 Cel	0 Cel		TIN LEAD	QUAD	S-PQFP-G44		2.45 mm		10 mm	Not Qualified	e0			10 mm
AD9869BCPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
AD8315ARM-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		Tin/Lead (Sn85Pb15)	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified	e0		240	3 mm
ADN2913ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	3	1 mm		4 mm		e3		260	4 mm
AD9861BCPZ-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
HMC1030LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	1	1 mm		5 mm		e3			5 mm
ADF7024BCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.8 mm		5 mm		e4	30	260	5 mm
LTC5589IUF#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	R-PQCC-N24	1	.8 mm		6 mm		e3	30	260	6 mm
ADV7480BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	1.4 mm		9 mm		e1	30	260	9 mm
ADN2830ACP-32-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified	e0			5 mm
AD73360ASU	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G44	3	1.2 mm		10 mm	Not Qualified	e0		240	10 mm
AD8315ARM-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		TIN LEAD	DUAL	S-PDSO-G8		1.1 mm		3 mm	Not Qualified	e0			3 mm
AD9866BCP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
ADN2890ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e3		260	3 mm
ADN2891ACPZ-500RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
ADF7024BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.8 mm		5 mm		e4	30	260	5 mm
ADV7480BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	1.4 mm		9 mm		e1	30	260	9 mm
ADN2890ACP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD OVER SILVER	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
AD9863BCPZRL-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e3		260	9 mm
ADN2891ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
AD9865BCPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
MAX1471ATJ/V+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	34	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100	.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N34	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
MAX19996ETP+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
MAX2181ETE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N16		.8 mm		3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
MAX2023ETX+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.345 mA	5 V	5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm		6 mm	Not Qualified	e3	30	260	6 mm
MAX2181ETE/V+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	1	.8 mm		3 mm		e3	30	260	3 mm
MAX7036GTP+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm		5 mm		e3	30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.