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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CYBLE-222014-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			.762 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N22	3	1.9 mm	10 mm					10 mm
CC2530F256RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
SJA1105TELY	NXP Semiconductors	TELECOM CIRCUIT		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B159	3	1.5 mm	12 mm				260	12 mm
SX1503I091TRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N28		.6 mm	4 mm	Not Qualified	e3			4 mm
TUSB211IRWBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm		e4	30	260	1.6 mm
MAX2771ETI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
L86-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		SQUARE	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		S-XDMA-N12		7.15 mm	18.4 mm				260	18.4 mm
TRF37B73IDSGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e4	30	260	2 mm
HMC624ALP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N24	1	1 mm	4 mm		e3		260	4 mm
LBWA1UZ1GC-958	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD		LGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY				85 Cel	-30 Cel		BOTTOM		S-PBGA-N
SN65DSI83ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm		e1	30	260	5 mm
CC2520RHDT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			30	260	10 mm
BLUENRG-132	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
OPA2380AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OPA2380AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
ADRV9009BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1		260	12 mm
PN5120A0HN1/C2,157	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES								1.8/3.3,2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1			Not Qualified			260
MAX3946ETG+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BIPOLAR				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm		e3	30	260	4 mm
ADRV9009BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1		260	12 mm
AD9874ABSTRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS				3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
CY7B933-JXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			.16 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
SX1502I087TRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N20		.6 mm	3 mm	Not Qualified	e3			3 mm
CC2640R2FTWRGZTQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1 Mbps	S-PQCC-N48	3	1 mm	7 mm		e3	30	260	7 mm
RTL8152B-VB-CG	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N24		.9 mm	4 mm					4 mm
EVA-M8M-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	43		SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-B43	3	1.16 mm	7 mm					7 mm
CC2640R2FYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm		e1	30	260	2.684 mm
SN65DSI86IPAPQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
AD9874ABST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS				3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
HMC641ALP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				-5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm		e3		260	4 mm
88E6176-A1-TFJ2I000	Marvell Technology	TELECOM CIRCUIT		GULL WING	128	QFP	SQUARE	PLASTIC/EPOXY	YES	1								FLATPACK							QUAD		S-PQFP-G128
EVA-M8M-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	43	XMA	SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N43		1.16 mm	7 mm					7 mm
SN65DSI86IPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
BGM123A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm					6.5 mm
EQCO62T20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
CC1200RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e4	NOT SPECIFIED	260	5 mm
CC1125RHMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified	e4	30	260	5 mm
PE4312C-Z	Psemi	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		-3.3 V		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e4	30	260	4 mm
AT86RF215-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm		e3			7 mm
CC2500RGPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.25 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
SIM900	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.0856 Mbps	S-XQMA-N68
ISP1507-AX-JT	Insight Sip	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	62	XMA	SQUARE	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N62	3		8 mm			30	260	8 mm
MAX24287ETK+	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N68		.8 mm	8 mm					8 mm
OPA380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS			.0088 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
AX5243-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3	30	260	4 mm
CC2530F256RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
L80-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		SQUARE	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		DUAL		S-XDMA-N12		7.05 mm	16 mm			NOT SPECIFIED	NOT SPECIFIED	16 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.