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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC430F6137IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified	e4	30	260	9 mm
MGC3130-I/MQ	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N28		1 mm	5 mm		e3			5 mm
SIM7600G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	135	XMA	SQUARE	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	42 Mbps	S-XXMA-N135
PN5120A0HN1/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified	e4		260	5 mm
OPA380AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1				.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
SN65DSI83ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm					5 mm
CC2541F256TRHATQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
EVA-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	43	XMA	SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N43		1.16 mm	7 mm					7 mm
ST7580	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			.03 mA	13 V	13	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
AFE031AIRGZT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.0053 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
CC2564CRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm		e3	30	260	8 mm
CY7B923-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
OPA2380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
CC2640R2FYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm		e1	30	260	2.684 mm
EM357-RTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TRF7970ARHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
MRF39RAT-I/LY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	5 mm					5 mm
CLRC66302HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
HMC1122LP4METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.95 mm	4 mm					4 mm
TDA7116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
BLUENRG-MSQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm					5 mm
CYBLE-214015-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32	3	1.8 mm	11 mm					11 mm
OPA2380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2					.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
NRF51822-CFAC-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel	-25 Cel		BOTTOM		S-PBGA-B62		.55 mm	3.83 mm			NOT SPECIFIED	NOT SPECIFIED	3.83 mm
SX1278IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm	Not Qualified	e3		260	6 mm
ADRF5044BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1				-3.3 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
CY7B933-JXIT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			.16 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CC1175RHMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified	e4	30	260	5 mm
AS3933-BQFT	Ams Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16	3	.9 mm	4 mm				260	4 mm
CC430F5135IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
SIM900D	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	XMA	SQUARE	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.0856 Mbps	S-XXMA-N48
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm			30	260	10 mm
TUSB211RWBR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm		e4	30	260	1.6 mm
BGM121A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm					6.5 mm
CC2564CRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm		e3	30	260	8 mm
CC2640F128RSMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	3	1 mm	4 mm		e4	NOT SPECIFIED	260	4 mm
MFRC63102HN,151	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	.4 Mbps	S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
ADRF5044BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1				-3.3 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
TDK5101FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
HMC641ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				-3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
LE910C1-EU	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	BUTT	181	LGA	SQUARE	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-XBGA-B181		2.2 mm	28.2 mm					28.2 mm
PN5321A3HN/C106	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm		e4	30	260	6 mm
HMC773ALC3BTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N12	3	.92 mm	3 mm		e4			3 mm
LTC5596IDC#TRMPBF	Analog Devices	TELECOM CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			MATTE TIN	DUAL		S-PDSO-N8		.8 mm	2 mm		e3			2 mm
PM-8916-0-176NSP-TR-02-1-01	Qualcomm	TELECOM CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		HVCMOS				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM		S-PBGA-B176	3	.86 mm	6.2 mm					6.2 mm
SI4432-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
CC2640F128RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	3	1 mm	5 mm		e4	NOT SPECIFIED	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.