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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ESP8285H16	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32	3	.9 mm	5 mm		e3	30	250	5 mm
NRF905	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm	Not Qualified		30	260	5 mm
ATA8352-7MQW	Microchip Technology	TELECOM CIRCUIT		BALL	33	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA33,6X6,25		.65 mm	105 Cel	-40 Cel		BOTTOM	1 Mbps	S-PBGA-B33		1.1 mm	4.5 mm					4.5 mm
CC2430ZF128RTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified	e4	30	260	7 mm
ISL32277EIRZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N24	3	1 mm	4 mm		e3	30	260	4 mm
LM15851NKE10	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N68		1 mm	10 mm					10 mm
LTC5596HDC#TRPBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3		260	2 mm
PLM15851NKE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N68		1 mm	10 mm					10 mm
TLE8457ALEXUMA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLK2711HFG/EM	Texas Instruments	TELECOM CIRCUIT		FLAT	68	GQFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1					2.5 V		FLATPACK, GUARD RING			.64 mm				QUAD		S-CQFP-F68		2.68 mm	13.97 mm			NOT SPECIFIED	NOT SPECIFIED	13.97 mm
BLUENRG-345AT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
CC430F5135IRGZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
EFR32BG21A010F1024IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N32	2	.9 mm	4 mm			40	260	4 mm
HMC8200LP5ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	1 mm	5 mm		e4		260	5 mm
LTC5586IUH#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	.8 mm	6 mm		e3	30	260	6 mm
MAX2851ITK+T	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N68	3	.8 mm	10 mm		e3	30	260	10 mm
MAX7060ATG+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
RFFC2071SR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
RFFC5072ATR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm					5 mm
RTL8152BN-VB-CG	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.05 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N48		1 mm	6 mm					6 mm
SST12LP17E-QU8E	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	3	.6 mm	2 mm		e3			2 mm
SX1273IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm		e3		260	6 mm
AD6624AABCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e1		260	15 mm
ADN2915ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.3774 mA	3.3 V	1.2,1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3			4 mm
CC8521RHAR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC8521RHAT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
DS100BR111SQE/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	10300 Mbps	S-XQCC-N24	3	.8 mm	4 mm		e3	30	260	4 mm
LTC5596HDC#TRMPBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3		260	2 mm
ONET8501PRGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	NOT SPECIFIED	260	3 mm
PE64904MLBB-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.6 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.08SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-XQCC-N10	1	.5 mm	2 mm		e4	30	260	2 mm
RFFC5072ASR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
SI4432-B1-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
BQ500212ARGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
HMC1122LP4ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.95 mm	4 mm					4 mm
HMC625BLP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	3	1 mm	5 mm		e3	30	260	5 mm
LTC5596HDC#PBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3			2 mm
XE1205I074TRLF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		.075 mA	3.3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N48		.9 mm	8 mm	Not Qualified	e3			8 mm
ZGM130S037HGN2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE		YES						1.8 V		CHIP CARRIER	LCC64,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N64	3	1.3 mm	9 mm			40	260	9 mm
ADRF6850BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.44 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	1 mm	8 mm	Not Qualified	e3			8 mm
ATA5745-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm	Not Qualified				5 mm
ATA8401C-6AQY66	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				11.6 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified				3 mm
ATA8401C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified	e3			3 mm
AWL9966RS36P8	Ii-vi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	2	.6 mm	4 mm	Not Qualified				4 mm
BGS13S2N9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	1		MOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBGA-B9	1	.4 mm	1.1 mm		e3			1.1 mm
EFR32BG21A010F512IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N32	2	.9 mm	4 mm		e3	40	260	4 mm
FIDO2100BGA128IR0	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	128	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B128		1.3 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC1023LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	1 mm	5 mm		e3	30	260	5 mm
MFRC63002HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.