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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1110F32RSPG3	Texas Instruments		INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES				CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36		3			Not Qualified				e4	30	260
CC2530F128RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40		3	1 mm	6 mm	Not Qualified				e4	30	260	6 mm
CC430F5133IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48		3	1 mm	7 mm	Not Qualified				e4	30	260	7 mm
CC430F6127IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
CC430F6135IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
CMX972Q5	Cml Microcircuits		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES						20 mA	3.3 V	3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N32					Not Qualified
CMX994Q4	Cml Microcircuits	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N40			1 mm	6 mm	Not Qualified							6 mm
EQCO31R20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16		1	.9 mm	4 mm					e4	30	260	4 mm
ESP8285N08	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel		-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32		3	.9 mm	5 mm					e3	30	250	5 mm
HMC625BLP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N32		3	1 mm	5 mm					e3	30	260	5 mm
IPJ-P6005-X2BT	Impinj	TELECOM CIRCUIT	OTHER	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	1						1.6 V		CHIP CARRIER, VERY THIN PROFILE	LCC8,0.079,25		.9 mm	95 Cel		-25 Cel		QUAD	.4 Mbps	S-XQCC-N8		1	.35 mm	2 mm						30	260	2 mm
LTC5589IUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel		-40 Cel	MATTE TIN	QUAD		R-PQCC-N24			.8 mm	6 mm					e3			6 mm
MAX7060ATG/V+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N24		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
MRF24J40-I/MLVAO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N40			1 mm	6 mm								6 mm
NJG1157PCD-TE1	New Japan Radio	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DMA	SQUARE	UNSPECIFIED	YES	1						1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	105 Cel		-40 Cel		DUAL		S-XDMA-N10			.63 mm	2.5 mm			HEAT SINK AVAILABLE					2.5 mm
ONET8501VRGPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N20		3	1 mm	4 mm	Not Qualified				e4	NOT SPECIFIED	260	4 mm
OPA2381AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8		2	1.1 mm	3 mm	Not Qualified				e4	30	260	3 mm
OPA381AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8		2	1.1 mm	3 mm	Not Qualified				e4	30	260	3 mm
P9038-RNDGI	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N56		3	1 mm	7 mm					e3		260	7 mm
P9038-RNDGI8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N56		3	1 mm	7 mm					e3		260	7 mm
PE42423B-Z	Psemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel		QUAD		S-XQCC-N16		3	.9 mm	3 mm								3 mm
PSB21150FV1.4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G64		3	1.6 mm	10 mm							260	10 mm
RF6545	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	3.3	CHIP CARRIER	LCC20,.14SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N20			.5 mm	3.5 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3.5 mm
SE2568U-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		DUAL		S-PDSO-N8			.5 mm	2 mm						NOT SPECIFIED	NOT SPECIFIED	2 mm
SI4010-C2-GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G10		2	1.1 mm	3 mm	Not Qualified				e4	40	260	3 mm
SI4735-B20-GMR	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel		QUAD		S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY13453-385LF	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	QCCN	SQUARE	UNSPECIFIED	YES	1						2.8 V		CHIP CARRIER				90 Cel		-40 Cel		QUAD		S-XQCC-N6		1	.5 mm	1 mm							260	1 mm
SL3S4021FHKH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES								1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N8		1			Not Qualified				e4	30	260
SX1508BIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N20		1	.6 mm	3 mm					e3		260	3 mm
SX1509IULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N28			.6 mm	4 mm	Not Qualified				e3			4 mm
TGA2976-SM	Qorvo	TELECOM CIRCUIT		NO LEAD	14	HQCCN	SQUARE		YES	1						40 V		CHIP CARRIER, HEAT SINK/SLUG	LCC14,.2SQ,20		.5 mm				Nickel/Gold (Ni/Au)	QUAD		S-XQCC-N14		3	1.64 mm	4 mm			SEATED HEIGHT NOMINAL		e4	NOT SPECIFIED	NOT SPECIFIED	4 mm
VSC8490YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel		-40 Cel		BOTTOM	10000 Mbps	S-PBGA-B196			1.4 mm	15 mm								15 mm
XE1203FI063TRLF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.075 mA	3.3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD		S-PQCC-N48			.9 mm	7 mm	Not Qualified				e3			7 mm
ZOE-M8G-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	XMA	SQUARE	UNSPECIFIED	YES	1				AEC-Q100		1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-40 Cel		BOTTOM		S-XXMA-B51		3	1.165 mm	4.5 mm								4.5 mm
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N16		3	.9 mm	3 mm	Not Qualified				e3		260	3 mm
ADN2892ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N16		3	.9 mm	3 mm	Not Qualified				e3	30	260	3 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2			.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL		3.4 V	e4	30	260	12 mm
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1						3.5 V		CHIP CARRIER			.4 mm	85 Cel		-30 Cel		BOTTOM		S-XBCC-B20		1	.77 mm	2.3 mm								2.3 mm
BLUENRG-345VC	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49			.42 mm	3.14 mm								3.14 mm
CC1201RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32		3	1 mm	5 mm	Not Qualified				e4	NOT SPECIFIED	260	5 mm
CC2541F256TRHARQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40		3	1 mm	6 mm					e4	30	260	6 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28		3	4.572 mm	11.5316 mm	Not Qualified				e3	20	260	11.5316 mm
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified				e0			16.585 mm
DS2174Q+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified				e3		245	16.585 mm
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel		-40 Cel		QUAD	2 Mbps	S-XQCC-N48			.9 mm	7 mm								7 mm
ESP32-S0WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.35 mm	125 Cel		-40 Cel		QUAD		S-XQCC-N48			.9 mm	5 mm								5 mm
GS2971-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100		1	1.7 mm	11 mm					e1		260	11 mm
HMC560LM3	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1								CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel		-55 Cel	GOLD OVER NICKEL	QUAD		S-PQCC-N6		1	1.14 mm	5.08 mm	Not Qualified				e4		250	5.08 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.