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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC572LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel		QUAD		S-XQCC-N32		1.12 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
LT5575EUF	Analog Devices		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES				155 mA	5 V	5	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-N16				Not Qualified	e0
LTC5800IWR-IPRB#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	SILVER	QUAD		S-PQCC-N72		1 mm	10 mm		e4			10 mm
MAX5980AGTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
NRF52832-CHAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.95 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
NRF9E5	Nordic Semiconductor Asa		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					3 V	3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32				Not Qualified
OPA381AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
PM5991B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B1932
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified			260
STID135	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		QCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N						NOT SPECIFIED	NOT SPECIFIED
WFM200SS22XNA2	Silicon Labs	TELECOM CIRCUIT		NO LEAD	52	LGA	SQUARE	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY	LGA52(UNSPEC)		.5 mm	105 Cel	-40 Cel		BOTTOM	72.2 Mbps	S-XLGA-N52	3	1.4 mm	6.5 mm			40	260	6.5 mm
ATA5749C-6DQY	Atmel	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm					3 mm
ATA5749C-6DQY-64	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.04 Mbps	S-PDSO-G10	2	1.1 mm	3 mm		e3	40	260	3 mm
CC2531F128RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
GP2015/IG/FP1Q	Zarlink Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e0		260	7 mm
MRF24J40T-I/ML	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	1 mm	6 mm	Not Qualified	e3	40	260	6 mm
SE2435L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4 V	4	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	.9 mm	4 mm	Not Qualified	e4		260	4 mm
TLK2501IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
CYW20736A1KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-30 Cel	PURE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm					5 mm
PM5990B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B1932
LT5554IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
SE5004L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY85716-11	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	QCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER							QUAD		S-XQCC-N16						NOT SPECIFIED	NOT SPECIFIED
AD9856ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
SI3462-E01-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm					3 mm
BGM123N256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm			40	260	6.5 mm
CY7B923-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		95 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e0			11.5316 mm
SE2438T-R	Skyworks Solutions	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4313-B1-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified	e3	40	260	4 mm
SI4362-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm					4 mm
LXMS33HCNK-171	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N		.75 mm	3.2 mm					3.2 mm
MAX24188ETK2	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N68		.8 mm	8 mm		e3			8 mm
HMC743LP6CETR	Hittite Microwave	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	6 mm					6 mm
SI4431-B1-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
CYRF6936-40LTXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified	e4	20	260	6 mm
EFR32BG1B132F256GM32-C0R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N32	2	.9 mm	5 mm		e3	NOT SPECIFIED	260	5 mm
SI4012-C1001GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4355-B1A-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER				85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2				e3	40	260
SKY66421-11	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY85755-11	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	QMA	SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY							QUAD		S-XQMA-N16	3
CY7B9334-270JXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.572 mm	11.5316 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
EFR32BG13P532F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.9 mm	5 mm			40	260	5 mm
EFR32BG21A020F768IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N32	2	.9 mm	4 mm		e3	40	260	4 mm
PI2EQX4402DNBE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified	e1			9 mm
SKY85717-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	QCCN	SQUARE		YES	1						CHIP CARRIER	QUAD16(UNSPEC)						QUAD		S-XQCC-N16						NOT SPECIFIED	NOT SPECIFIED
SKY85717-21	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	QCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER							QUAD		S-XQCC-N16						NOT SPECIFIED	NOT SPECIFIED
SR040HN/B02BY	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40	2A	1 mm	6 mm				260	6 mm
BC63B239A04-IQD-E4	Qualcomm	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	UNSPECIFIED	YES	1				1.5 V		CHIP CARRIER							QUAD		S-XQCC-N40

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.