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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.57 mm	11.53 mm	Not Qualified		e0			11.53 mm
EFR32BG1B132F256GM32-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	40	260	5 mm
EFR32BG1V132F256GM32-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	40	260	5 mm
IA3222B-F-FTR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	10	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.508 mm	85 Cel	-25 Cel		DUAL		S-PDSO-G10		.9652 mm	3.048 mm				NOT SPECIFIED	NOT SPECIFIED	3.048 mm
MC33742PEP/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	5.5/18	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Network Interfaces	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e3	40	260	7 mm
MGA-43024-BLKG	Broadcom	TELECOM CIRCUIT		NO LEAD	28		SQUARE	UNSPECIFIED	YES	1				5 V		MICROELECTRONIC ASSEMBLY			.5 mm				QUAD		S-XQMA-N28	3	.92 mm	5 mm					260	5 mm
SE2576L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
SE5516A-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B24		1.15 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI3462-E01-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm						3 mm
SI4010-C2-ATR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4012-C1001GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4063-B1B-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI4063-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm						4 mm
SI4355-B1A-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER				85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2					e3	40	260
SI4455-B1A-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.9 mm	3 mm			e3	40	260	3 mm
SI4737-C40-GM	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N20	3	.6 mm	3 mm			e3	40	260	3 mm
SI4743-C10-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
SJA1105TEL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm			e1		260	12 mm
SKY85746-11	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	QMA	SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY							QUAD		S-XQMA-N16	1							260
ATA5428-PLQW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48		1 mm	7 mm	Not Qualified		e3			7 mm
AWT6652Q7	Ii-vi	TELECOM CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.4 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm				DUAL		S-PDSO-N10	3	1 mm	3 mm						3 mm
BC57G687C-ANN-E4	Qualcomm	TELECOM CIRCUIT		BALL	105	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA105,11X11,32		.8 mm	85 Cel	-40 Cel		BOTTOM	12 Mbps	S-PBGA-B105		1.6 mm	10 mm						10 mm
BCM20733A3KML1G	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm						7 mm
BCM20736A1KML2G	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
BCM20736E	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BUTT	48	TFLGA	SQUARE	UNSPECIFIED	YES	1						GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B48		1.18 mm	6.5 mm						6.5 mm
BCM4330FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B144		1 mm	6.5 mm						6.5 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16		.4 mm	60 Cel	0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm		Also has 1.2 V core supply				10 mm
BCM5389KFBG	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY							BOTTOM		S-PBGA-B256							NOT SPECIFIED	NOT SPECIFIED
CYBLE-214009-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32		1.8 mm	11 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
CYBLE-222005-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N22		1.6 mm	10 mm						10 mm
EFR32BG13P532F512GM48-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	2	.9 mm	7 mm			e3	40	260	7 mm
EFR32BG13P632F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.9 mm	5 mm				40	260	5 mm
HSP50214BVIZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	120	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G120	3	4.07 mm	28 mm	Not Qualified		e3			28 mm
SE2547A-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	32	TFLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B32		1.1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
SE4150L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	1	1 mm	4 mm						4 mm
SE5003L1-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20	3	.9 mm	4 mm					260	4 mm
SI2166-B22-GM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG				75 Cel	-10 Cel		QUAD		S-XQCC-N48							NOT SPECIFIED	NOT SPECIFIED
SI2167-D60-GM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG				75 Cel	-10 Cel		QUAD		S-XQCC-N48
SI2169-B40-GM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER				75 Cel	-10 Cel	MATTE TIN	QUAD		S-XQCC-N48	2					e3	40	260
SI21822-B60-GM/R	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG				75 Cel	-10 Cel		QUAD		S-XQCC-N68
SI2183-B60-GM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG				75 Cel	-10 Cel		QUAD		S-XQCC-N48							NOT SPECIFIED	NOT SPECIFIED
SI32392-B-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
SI4060-B1B-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4063-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.15SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4355-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4438-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm						4 mm
SI4737-C40-GMR	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N20	3	.6 mm	3 mm			e3	40	260	3 mm
SKY66422-11	Skyworks Solutions	TELECOM CIRCUIT		UNSPECIFIED	16	XMA	SQUARE	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY							UNSPECIFIED		S-XXMA-X16

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.