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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TRF3722IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	2	1 mm	7 mm				e4	30	260	7 mm
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm							15 mm
WP3160W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B672
WP3161W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B672
ADF7023BCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified			e4	30	260	5 mm
ADF7030-1BCPZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40	3	.8 mm	6 mm					30	260	6 mm
ADRV9004BBCZ	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2					1 V		GRID ARRAY			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.25 mm	12 mm					30	260	12 mm
AFE7903IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1					.925 V		GRID ARRAY	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e1		260	17 mm
AT88RF1354-ZU	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.25 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.106 Mbps	S-XQCC-N36		.9 mm	6 mm	Not Qualified			e3			6 mm
ATA8202C-PXQW-1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.20SQ,25		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.02 Mbps	S-XQCC-N24		.9 mm	5 mm				e3			5 mm
ATA8520E-GHPW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	.0006 Mbps	S-XQCC-N32		.9 mm	5 mm				e3			5 mm
BGS15GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm				e4			2 mm
BLUENRG-132Y	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
CC2550-RTY1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm	4 mm				e4	30	260	4 mm
CC430F5133IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC430F6135IRGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N64	3	1 mm	9 mm	Not Qualified			e4	30	260	9 mm
EFR32BG13P732F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48	3	.9 mm	7 mm					40	260	7 mm
EFR32BG13P732F512GM48-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	2	.9 mm	7 mm				e3	40	260	7 mm
IS1678SM-151-TRAY	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	70 Cel	-20 Cel		QUAD		S-XQCC-N40		.9 mm	6 mm							6 mm
KGL4195KD	Lapis Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER			.5 mm	95 Cel	-40 Cel		QUAD		S-XQCC-N24		1.65 mm	4 mm	Not Qualified						4 mm
LMH0074SQE	National Semiconductor		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES					77 mA	3.3 V	3.3	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N16	1			Not Qualified			e0	40	260
LNBH26LSPQR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N24	1	1 mm	4 mm							4 mm
MRF24XA-I/MQ	Microchip Technology		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES							1.2,3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32				Not Qualified			e3
NCV7428MW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm				e3	30	260	3 mm
OPA2381AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	2				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
PE64904C-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.6 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.08SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N10	1	.5 mm	2 mm				e4	10	260	2 mm
PN5120A0HN/C2	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm	Not Qualified						6 mm
PN5120A0HN1/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified			e3/e4			5 mm
SA636BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20	1	1 mm	4 mm					30	260	4 mm
SE2611T-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SE2614BT-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20	1	.6 mm	3 mm							3 mm
SN65LVPE501RGET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2	2	CMOS		.12 mA	3.3 V	3.3	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	5 Mbps	S-PQCC-N24	2	1 mm	4 mm	Not Qualified			e4	30	260	4 mm
TC35678FSG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
TFF11139HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm						260	4 mm
TQP9221	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	LSON	SQUARE	PLASTIC/EPOXY	YES	1					4.5 V		SMALL OUTLINE, LOW PROFILE			1.06 mm	85 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	DUAL		S-PDSO-N14	3	1.4 mm	7 mm				e4	NOT SPECIFIED	NOT SPECIFIED	7 mm
TSC2200IRHB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	SINGLE-ENDED		e4	30	260	5 mm
UBX-G6010-ST	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N56
WP3161F5NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B672
ADF7023BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified			e4	30	260	5 mm
ADN2892ACPZ-500RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm	Not Qualified			e3	30	260	3 mm
ADRF6516ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm				e3		260	5 mm
ADRF6850BCPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.44 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	1 mm	8 mm	Not Qualified			e3	30	260	8 mm
ATA5291-GJQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm				QUAD	2 Mbps	S-XQCC-N48		.95 mm	7 mm							7 mm
BCM8727	Broadcom	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY							BOTTOM		S-PBGA-B324				Not Qualified
BGM121N256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm					40	260	6.5 mm
BGS13GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14	1	.65 mm	2 mm				e4			2 mm
BQ500211ARGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm				e4	30	260	7 mm
BQ500211ARGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm				e4	30	260	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.