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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AFE7903IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1				.925 V		GRID ARRAY	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e0		220	17 mm
BGS14GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm			e4			2 mm
BLUENRG-345AC	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	2 Mbps	S-PQCC-N32	3	1 mm	5 mm			e4		260	5 mm
BQ500211RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	NOT SPECIFIED	260	7 mm
CMX992Q3	Cml Microcircuits	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	7 mm	Not Qualified					7 mm
CY7B933-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
CYRF7936-40LFXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				2.4 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified		e3	20	260	6 mm
LTC5100EUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
PGA5807ARGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
QN9080CHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		1 mm	6 mm						6 mm
RFPA5201ESR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	HTSON	SQUARE	UNSPECIFIED	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE				85 Cel	-40 Cel		DUAL		S-XDSO-N14		1.05 mm	7 mm						7 mm
RFPA5201ETR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	HTSON	SQUARE	UNSPECIFIED	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE				85 Cel	-40 Cel		DUAL		S-XDSO-N14		1.05 mm	7 mm						7 mm
SI4313-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified		e3	40	260	4 mm
SIM7000E-N	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.066 Mbps	S-XQMA-N68
TLK2711JRGQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B80		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
TLK2711JRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified		e1	30	260	5 mm
WP3161D4NFEI-400B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B672
AD8285WBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm	10 mm			e3	30	260	10 mm
AP22814ASN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm	2 mm			e4	30	260	2 mm
ATA8710-GHQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	32		SQUARE	UNSPECIFIED	YES	1				5 V			LCC32(UNSPEC)			85 Cel	-40 Cel		QUAD	.08 Mbps	S-XQCC-N32
BGS15AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD		S-PQCC-N16	1	.77 mm	2.3 mm			e3			2.3 mm
CC2538NF53RTQT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm			e4	30	260	8 mm
CC8520RHAR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
CY7B933-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
CY7B933-JIT	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
GS2988-INTE3	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	4 mm			e3		260	4 mm
GS2988-INTE3Z	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	4 mm			e3		260	4 mm
HMC1094LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm			e3	30	260	3 mm
HMC862ALP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	3	1 mm	3 mm			e3	30	260	3 mm
LMX8410RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
LNBH26SPQR	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N24	1	1 mm	4 mm						4 mm
LTC5586IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32		.8 mm	6 mm			e3			6 mm
LTC5587IDD#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			.45 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N12	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MC100SX1230FN	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified		e0		235	11.505 mm
MD0100DK6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16SQ,40		1 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
NRF24LE1-F16Q32-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N32		.9 mm	5 mm						5 mm
RF37S114HTFJB	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				70 Cel	-25 Cel		UNSPECIFIED		S-XXMA-X	1	.76 mm	4 mm		SEATED HT-CALCULATED			260	4 mm
RF430CL331HIRGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N16	2	1 mm	3 mm			e4	30	260	3 mm
SA616BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20	1	1 mm	4 mm				30	260	4 mm
SI4438-B1C-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4744-C10-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
SI4777-A20-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.9 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SN65DSI85ZQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
SN761633RTAR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	.8 mm	6 mm	Not Qualified		e4	30	260	6 mm
STS1TXQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TDA7116F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified				260	3 mm
TDA7116FXT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TFF11145HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.