SQUARE Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

J-F2-B3E9-DY

Telit Communications Plc

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

S-XQCC-N32

2.6 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

LTC5587IDD#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.45 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC5800IWR-WHMA#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N72

1

1 mm

10 mm

30

260

10 mm

SI2166-B20-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER

75 Cel

-10 Cel

MATTE TIN

QUAD

S-XQCC-N48

2

e3

40

260

SIM5300EA

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

68

QMA

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

7.2 Mbps

S-XQMA-N68

Operates with 3.4V TO 4.4V supply

AD8314ARMZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

AD9866BCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

1 mm

9 mm

Not Qualified

e3

260

9 mm

ATA5746-PXQW

Atmel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

5 mm

Not Qualified

5 mm

BGS16GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-N14

1

.65 mm

2 mm

2 mm

BGX220S22HNA21R

Silicon Labs

TELECOM CIRCUIT

NO LEAD

44

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.5 mm

105 Cel

-40 Cel

UNSPECIFIED

2 Mbps

S-XXMA-N44

1.28 mm

6 mm

6 mm

CY7C924ADX-AXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.25 mA

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

LTC5551IUF#TRPBF

Analog Devices

TELECOM CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

MATTE TIN

QUAD

S-PQCC-N16

1

.8 mm

4 mm

e3

30

260

4 mm

PI3EQX1001XUAEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

18

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N18

.4 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

RTL8139DL-LF

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

SI2166-D60-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N48

SKY13473-569LF

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

90 Cel

-40 Cel

QUAD

S-XQCC-N20

.8 mm

2.4 mm

NOT SPECIFIED

NOT SPECIFIED

2.4 mm

AMMP-6532-TR2G

Broadcom

TELECOM CIRCUIT

BUTT

8

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

NICKEL GOLD

BOTTOM

S-XBCC-B8

3

2.25 mm

5.215 mm

Not Qualified

e4

20

260

5.215 mm

NRF24LE1-F16Q48-R7

Nordic Semiconductor Asa

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-XQCC-N48

.9 mm

7 mm

7 mm

OL2381AHN/C0B,515

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.0012 mA

2.7 V

2.7

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

2A

.85 mm

5 mm

Not Qualified

260

5 mm

RFFC2071TR7

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

RTL8139DL

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

RTL8139DL-GR

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

SI32391-B-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

STA8090GATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

8 mm

e3

250

8 mm

80HCPS1432CHMGI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

e1

NOT SPECIFIED

245

25 mm

AD9864BCPZRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.02 Mbps

S-XQCC-N48

3

1 mm

7 mm

e3

30

260

7 mm

AFE4300PNR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BINARY/TWOS COMP

2

.00097 mA

3.3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Codecs

.5 mm

70 Cel

16

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

VOLTAGE

3

1.6 mm

12 mm

Not Qualified

DIFFERENTIAL

3.4 V

e4

30

260

12 mm

BGM121A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM121A256V1R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BLUENRG-345MC

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

2 Mbps

S-PQCC-N48

3

1 mm

6 mm

e4

260

6 mm

BLUENRG-345MT

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

2 Mbps

S-PQCC-N48

3

1 mm

6 mm

e4

260

6 mm

BQ500212ARGZR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

GS2984-INE3

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N16

1

.9 mm

4 mm

e3

40

260

4 mm

LTC5551IUF#PBF

Analog Devices

TELECOM CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

MATTE TIN

QUAD

S-PQCC-N16

1

.8 mm

4 mm

e3

30

260

4 mm

PM5980B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

SI32391-B-FM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

ST25RU3992-BQFT

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

64

SQUARE

UNSPECIFIED

YES

1

LCC64(UNSPEC)

QUAD

S-XQCC-N64

Operates from 4.1V to 5.5V Supply

ST7570

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

ST7570TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

SY88403BLMG-TR

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

4250 Mbps

S-XQCC-N16

2

1 mm

3 mm

Not Qualified

e4

40

260

3 mm

AD73322AST

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

FLATPACK, LOW PROFILE

QFP44,.63SQ,40

Codecs

1 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

QUAD

S-PQFP-G44

3

1.6 mm

16-BIT

14 mm

Not Qualified

e0

240

14 mm

YES

AD73322AST-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

FLATPACK, LOW PROFILE

QFP44,.63SQ,40

Codecs

1 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

QUAD

S-PQFP-G44

3

1.6 mm

16-BIT

14 mm

Not Qualified

e0

240

14 mm

YES

AD8314ARM

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

240

3 mm

AD8314ARM-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

240

3 mm

AD8314ARMZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

ADN2830ACP32-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e0

240

5 mm

ADN2830ACP32-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e0

240

5 mm

ADRV9004BBCZ-RL

Analog Devices

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2

1 V

GRID ARRAY

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.25 mm

12 mm

30

260

12 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.