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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Input Code	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LM15851NKE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	4000 Mbps	S-PQCC-N68	3	.9 mm	10 mm			1.995 V	e3	30	260	10 mm
SN75FC1000BPJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			GAAS			.31 mA	3.3 V		3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
LM96570SQX	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1							1.8 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm							5 mm
DP83856BVF	Texas Instruments	TELECOM CIRCUIT		FLAT	132	QFF	SQUARE	PLASTIC/EPOXY	YES	1										FLATPACK			.635 mm					QUAD		S-PQFP-F132		4.45 mm	24.13 mm							24.13 mm
TRF2436IRTBRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						.55 mA	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel		-20 Cel	MATTE TIN	QUAD		S-PQCC-N40	3	.9 mm	6 mm	Not Qualified			e3	30	260	6 mm
PCM3794ARHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified			e4	30	260	5 mm
UCC2750Q	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				3 V			CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified						11.505 mm
LM96551SQE/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1										CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N80	3	.8 mm	12 mm				e3	30	260	12 mm
CC2430F64RTCRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
DS100BR111ASQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1							2.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N24		.8 mm	4 mm							4 mm
PCM3794ARHBTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified			e4	30	260	5 mm
GC4116-PBZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				2.5 V			GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B160	3	2.05 mm	15 mm	Not Qualified			e1	30	260	15 mm
TLC320AD545IPTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TWOS COMPLEMENT	1					3.3 V	TWOS COMPLEMENT	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	16	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified	DIFFERENTIAL	3 V	e4	30	260	7 mm
TLVAIC3104IRHBRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified			e4	30	260	5 mm
ADS58J64IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1							1.15 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm			2 V	e4	30	260	10 mm
TRF1600DRVR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1							3 V			SMALL OUTLINE			.65 mm					DUAL		S-PDSO-N6		.8 mm	2 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	2 mm
GC5328IZER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	484	HBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V			GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484	4	2.48 mm	23 mm	Not Qualified			e1	30	260	23 mm
TRF3722IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	2	1 mm	7 mm				e4	30	260	7 mm
PCM3793RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified			e4	30	260	5 mm
HPA00702F128RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm				e4	30	260	6 mm
TPS657202YFFR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm				e1	30	260	2.086 mm
CC2431ZRTCR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1										CHIP CARRIER							NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3		7 mm	Not Qualified			e4	30	260	7 mm
TLK1002RGE	Texas Instruments		COMMERCIAL	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES				CMOS			158 mA	1.8 V		1.8	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-N24	1			Not Qualified			e0	20	235
TLK1501IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TTL				2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified			e4	30	260	10 mm
TPS657052YZHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1							3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified			e1	NOT SPECIFIED	260	2.3 mm
LMX3162VBHX	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				3.6 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-10 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm							7 mm
TCM4301PZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1										FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD		S-PQFP-G100		1.6 mm	14 mm	Not Qualified						14 mm
DS100BR111ASQE/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		2					2.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	10300 Mbps	S-PQCC-N24	3	.8 mm	4 mm				e3	30	260	4 mm
TSB21LV03APM	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
PCM3794ARHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified			e4	30	260	5 mm
GC4014-CQ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1			CMOS				3.3 V			FLATPACK			.5 mm	85 Cel		-40 Cel		QUAD		S-CQFP-G100			14 mm	Not Qualified						14 mm
HPA01211RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		2					1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm				e4	30	260	5 mm
CC2430F64RTCG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC2430F128RTCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
RF430CL330HRGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N16		1 mm	3 mm							3 mm
TLK1501IRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TTL				2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified			e4	30	260	10 mm
TRF3703IRGER	Texas Instruments		INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES								5 V		5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N24				Not Qualified
TRF1500PFB	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR				3.75 V		3.75	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel		-30 Cel		QUAD		S-PQFP-G48		1.2 mm	7 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7 mm
LMX5001VBC	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.2 mm	7 mm	Not Qualified			e0			7 mm
TLK100PHPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1		3.3 V		1.1,1.8,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Network Interfaces	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified			e4	NOT SPECIFIED	260	7 mm
TRF370315IRGETG4	Texas Instruments		INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES								5 V		5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2			Not Qualified			e4	30	260
DP83950BVQB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				5 V			FLATPACK			.65 mm	70 Cel		0 Cel		QUAD		S-PQFP-G160		4.1 mm	28 mm							28 mm
AFE8221IRFPQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				AEC-Q100			1.8 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm	20 mm	Not Qualified			e4	30	260	20 mm
TPS657201YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm				e1	30	260	2.086 mm
TLK4015AIGPV	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V		2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified			e0	20	220	19 mm
ONET8501PRGTRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	3 mm	Not Qualified			e4	30	260	3 mm
TRF37A73IDSGR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	1	.8 mm	2 mm				e4	30	260	2 mm
CC8530RHAR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.