INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN41N-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm			e3			20.1 mm
RN42N-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	3 Mbps	R-XQMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm
NRF52840-QIAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	73	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBCC-N73	2	.85 mm	7 mm			e3			7 mm
RN42-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RN42HID-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
ESP32-WROOM-32D	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N38		3.2 mm	18 mm				30	250	25.5 mm
NRF52840-QIAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	73	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-N73	2	.85 mm	7 mm						7 mm
RN42XVP-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,20LEAD(UNSPEC)		2 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL	.3 Mbps	R-XDMA-T20			24.4 mm			e4			29.9 mm
MRF24WG0MB-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N36		2.7 mm	21 mm	Not Qualified		e3			31 mm
NRF52840-QIAA-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	73	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-N73	2	.85 mm	7 mm						7 mm
CC1190RGVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	2.5/3.3	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
BM71BLES1FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm				30	260	11.5 mm
CC430F5137IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
EQCO30T5.2	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	.95 mm	4 mm			e4	30	260	4 mm
AD9364BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
RN4871-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
BT121-A-V2-IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm						13.9 mm
NEO-M8N-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100	3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
RN41XVC-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-T20	1	2 mm	24.4 mm						29.9 mm
NRF52840-CKAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	BALL	93	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA93,10X10,14		.35 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-PBGA-B93	1	.514 mm	3.544 mm						3.607 mm
BL652-SA-01-T/R	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	39		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			.75 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N39	3	2.2 mm	10 mm				30	260	14 mm
CC1120RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
BT121-A-V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm						13.9 mm
NRF24L01P-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.95 mm	4 mm	Not Qualified					4 mm
ESP32-WROOM-32U	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N38		3.3 mm	18 mm				30	260	19.2 mm
RN4871-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
ZED-F9P-02B	U-blox Ag	GNSS Module	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR		YES	1		TS 16949	3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-B54							NOT SPECIFIED	NOT SPECIFIED
RN42-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
ESP32-WROVER-E	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38	DMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	150 Mbps	R-XDMA-N38	3	3.45 mm	18 mm					250	31.4 mm
NEO-M8N-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100; TS 16949	3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
ESP32-PICO-D4	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48		SQUARE	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel		QUAD		S-XQMA-N48		1.04 mm	7 mm						7 mm
NCH-RSL10-101Q48-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N48	3	1 mm	6 mm			e3	30	260	6 mm
NRF52833-QIAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	73	BCC	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				105 Cel	-40 Cel		QUAD	2 Mbps	S-XBCC-N73
SIM7600G-HR2	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	135	XMA	SQUARE	UNSPECIFIED	YES	1			3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	150 Mbps	S-XXMA-N135		2.9 mm	30 mm						30 mm
SIM800C	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	42	QMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.0856 Mbps	R-XQMA-N42					Operates with 3.4-4.4 V Supply
CC1125RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
CC2640R2FRHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	1 mm	5 mm			e4	30	260	5 mm
BMD-350-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N	3							250
CC2640R2FRHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	1 mm	5 mm			e4	30	260	5 mm
BM71BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
CC430F5137IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
ZED-F9P-01B	U-blox Ag	GNSS Module	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR		YES	1		TS 16949	3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-B54
EQCO30R5.D	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	1 mm	4 mm			e4	30	260	4 mm
RN4871-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN42XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm			e4			29.9 mm
BMD-340-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N	3							250
RN42-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
DW1000-ITR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	6.8 Mbps	S-XQCC-N48		.9 mm	6 mm		Also Require 3.3V Supply				6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.