INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STA8090EXGADTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STBLC01QTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

STA2500D

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

1.25 mm

6 mm

Not Qualified

e1

30

260

6 mm

STA8090GTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.9 mm

8 mm

8 mm

STA8090FGBTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

SPZB260

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

17

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N17

Not Qualified

STA264

STMicroelectronics

INDUSTRIAL

BALL

249

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

BGA249,17X17,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B249

Not Qualified

STA8088TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.9 mm

7 mm

7 mm

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B169

3

1.2 mm

9 mm

e3

260

9 mm

STLC60133

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

-6 V

6 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

Not Qualified

e0

9.7 mm

SPBT2532C2.AT

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N14

10.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

13.5 mm

L3092TN

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

-5 V

5 V

+-5

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

TDA7541W

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BLUENRGCSP

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B34

.5 mm

2.56 mm

NOT SPECIFIED

NOT SPECIFIED

2.66 mm

TDA7541

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TDA7541WTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

TDA7541B

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

BLUENRGQTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TDA7541BWTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G64

3

Not Qualified

e1

30

260

TDA7541BW

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G64

3

Not Qualified

e1

30

260

TDA7541TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

TDA7541BTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

MC72000

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.6 mm

7 mm

7 mm

UAA3202M-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.7 mA

3.5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

2 mm

5.3 mm

Not Qualified

e4

7.2 mm

SA9025BE-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.75 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

TZA3044T/C2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

UAA3220TS/V1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

8.2 mm

TFF1007HN/N1,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

SA9024BE-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.75 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

TZA3044BTT/C2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

5 mm

935059610118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

TZA3023U/G

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N13

Not Qualified

CD8390

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

4 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G48

Not Qualified

SL3ICS3001FW/V4,00

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

MWCT1011CFM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

e3

40

260

SA5217D-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

13.5 mA

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

40

250

12.8 mm

TZA3044BU

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

29

DIE

SQUARE

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

S-XUUC-N29

Not Qualified

SA9024BE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.75 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

TZA3033T/C2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

SL3S1002FTT

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

3 mm

SL3S1203FUD/BG,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

CMOS

.265 mA

1.8 V

1.8

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

TZA3043U/G

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N13

Not Qualified

CD8390-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

4 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G48

Not Qualified

935262928026

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

UAA3220TS/V1/S5

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e4

8.2 mm

TZA3033U/C3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

UAA3220TS

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0058 mA

5 V

2.7

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

260

8.2 mm

TZA3043BU

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N13

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.