INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SPZB32W1C1.1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	26		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N26		3.925 mm	16.4 mm					26.5 mm
MTC20136MB-I1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.7 mm	12 mm	Not Qualified	e1			12 mm
STA8090EXGAD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STA264TR	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B249				Not Qualified
STA8090EXGAJD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
E-STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B676	3			Not Qualified	e1
ST20GP6X33S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQFP-G100		3.4 mm	14 mm	Not Qualified	e4			20 mm
STA8058TR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104				Not Qualified
ST20GP1X33S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQFP-G100		3.4 mm	14 mm	Not Qualified	e4			20 mm
ST952	STMicroelectronics		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		HYBRID						FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G32				Not Qualified	e0
SPZB260-PRO	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	17		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-X17			13.7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	25 mm
E-STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B120		1.4 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
STA8090FG	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B99		1.2 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8088GTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm					7 mm
STA8088GA5	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	8 mm					8 mm
STLC5466	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G176		1.6 mm	24 mm	Not Qualified	e4			24 mm
STA5630TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Silver (Ag)	QUAD	S-XQCC-N32	3	1 mm	5 mm		e4	30	260	5 mm
L3092TFN	STMicroelectronics		INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J28				Not Qualified	e0
STA5620CTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL			VQCCN	SQUARE			1	BICMOS				2.7 V					.5 mm	85 Cel	-40 Cel	TIN			3	1 mm	5 mm		e3	30	260	5 mm
STA8088A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm					7 mm
STLC2411	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B132		1.2 mm	8 mm	Not Qualified	e0			8 mm
STLC1512	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e4			7 mm
SPWF01SA.11	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N25		2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B676				Not Qualified
STA311BTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
ST7590	STMicroelectronics		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			30 mA	18 V	18	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N48	3			Not Qualified	e3	40	260
SPWF04SC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N30		2.3 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
STLC5465B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	5	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G160		4.07 mm	28 mm	Not Qualified	e4			28 mm
STA8089GR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm					7 mm
SPBT2632C1A.AT2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1					2.5 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N24		2.9 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.9 mm
STA8090EXGAJTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
BT-STA2416C1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL	R-XDMA-N				Not Qualified
STA8089GRTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm					7 mm
STBLC01	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N24		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
STA5620ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL			VQCCN	SQUARE			1	BICMOS				2.7 V					.5 mm	85 Cel	-40 Cel	Tin (Sn)			3	1 mm	5 mm		e3	30	260	5 mm
STA8090EXGAJ	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STLC5460	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.57 mm	16.5862 mm	Not Qualified	e0			16.5862 mm
STA8090GA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
ST7590T	STMicroelectronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			30 mA	18 V	18	FLATPACK	TQFP100,.63SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	QUAD	S-PQFP-G100	3			Not Qualified	e1	30	260
MTC20455PQ-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQFP-G160		4.07 mm	28 mm	Not Qualified	e4			28 mm
STA8088G	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	7 mm					7 mm
SN250Q	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
STA8088GA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e3	40	260	7 mm
MTC20454-TQ-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified	e4			14 mm
SPZB260C-PRO	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	19		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N19		1.025 mm		Not Qualified		NOT SPECIFIED	NOT SPECIFIED	26.5 mm
STA2500DTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B48	3	1.25 mm	6 mm	Not Qualified	e1	30	260	6 mm
SPZB250	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	24		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL	R-XDMA-X24				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
STA8090EXGATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.