INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
19699-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified					10 mm
LC72709W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
N24RF16EDTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.2 mm	3 mm				NOT SPECIFIED	260	4.4 mm
AX5044-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	.2 Mbps	S-PQCC-N28		1 mm	5 mm						5 mm
AMIS-5300-A	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
SX073	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
AMIS-53000-M	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
TCP-5118UA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm			e1	5	260	.993 mm
AX5043	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N28		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
AX5042-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.25 Mbps	S-XQCC-N28		1 mm	5 mm			e4			5 mm
LC72709E	Onsemi		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44				Not Qualified
19637-001-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified					7 mm
FSA9480UCX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B25		.625 mm	2.1 mm						2.1 mm
N24RF64DTET3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8		1.2 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4.4 mm
AMIS-53050-I/A-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK	QFP32(UNSPEC)			85 Cel	-40 Cel		QUAD	.128 Mbps	R-PQFP-G32
LC72714W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			20 mA		3/3.3	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
N24RF64DWET3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						2.5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8		1.75 mm	3.9 mm				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
NCV-RSL10-101Q48-AVG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100			1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N48	1	.9 mm	7 mm			e3	30	260	7 mm
AX50311-1-WD1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS				3 V		UNCASED CHIP	DIE OR CHIP			85 Cel	-40 Cel		UPPER	2 Mbps	X-XUUC-N					DATA RATE 350 KBPS FOR FSK,MODULATION		NOT SPECIFIED	NOT SPECIFIED
MDC5001T1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				2.75 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e0		235	2 mm
N24RF64EDTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8	1	1.2 mm	3 mm				NOT SPECIFIED	260	4.4 mm
LV2283VB	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.25		.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.5 mm	4.4 mm						6.5 mm
FSA9280AUMX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1							CHIP CARRIER			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N20	1	.55 mm	3 mm	Not Qualified		e4	30	260	4 mm
LC72708E	Onsemi		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44				Not Qualified
19608-003-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
AX-SFAZ-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40		1 mm	5 mm			e4			7 mm
LV72715PLG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	68	VFLGA	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B68		.85 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
NB7VQ1006MMNG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
LV2257PTT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm						3 mm
LV2282VA	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.25		.2 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.5 mm	4.4 mm						6.5 mm
19608-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
N24RF64DTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02648 Mbps	R-PDSO-G8	1	1.2 mm	3 mm			e4	30	260	6.4 mm
LC72711W	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			25 mA	5 V	5	FLATPACK	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified
19637-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified					7 mm
19608-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
MC33169DTB-4R2	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	1.2 mm	4.4 mm	Not Qualified		e4			5 mm
MC33170DTBR2	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified		e4		260	5 mm
MC33169DTB-004	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified					5 mm
MC33169DTB-4.0	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14		1.2 mm	4.4 mm			e0			5 mm
MC33170DTB	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified		e4		260	5 mm
NCH-RSL10-01S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.25 V		CHIP CARRIER			.7 mm	85 Cel	-40 Cel		BOTTOM	4 Mbps	R-PBCC-B51		1.56 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
NCH-RSL10-101WC51-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	51	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA51,11X11,10		.252 mm	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2 Mbps	R-PBGA-B51	1	.381 mm	2.325 mm			e2	30	260	2.364 mm
STA8088ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm						7 mm
SPBT3.0DP1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N24		3 mm	15.24 mm				NOT SPECIFIED	NOT SPECIFIED	26.9 mm
STA210N	STMicroelectronics		INDUSTRIAL	NO LEAD	68	QCCN	SQUARE	PLASTIC/EPOXY	YES		BICMOS				3.3 V	3.3	CHIP CARRIER	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N68				Not Qualified
STMPE610QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	1	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B676				Not Qualified
STLC60133N	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-6 V		6 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified					9.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.