INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	24 Mbps	S-PBGA-B208		1.7 mm	17 mm	Not Qualified	e1			17 mm
STLC2415	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B120		1.4 mm	10 mm	Not Qualified				10 mm
E-ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B208		1.7 mm	17 mm	Not Qualified				17 mm
STA8088	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm					7 mm
STLC2500ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified				6 mm
STA8058A	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
SPZB32W1A14	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N25		3.7 mm	16.4 mm					26.5 mm
STA8088GATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e3	40	260	7 mm
STLC2690WTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	61	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V	1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA61,8X8,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B61		.6 mm	3.315 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3.56 mm
SPZB32W1A2.1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	26		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N26		3.925 mm	16.4 mm			NOT SPECIFIED	NOT SPECIFIED	26.5 mm
STA2500DCTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B48		1.25 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
SPZB32W1C2.1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	26		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N26		3.925 mm	16.4 mm			NOT SPECIFIED	NOT SPECIFIED	26.5 mm
SPBT2632C2A.AT2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	YES	1					2.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED		R-XXMA-N16	3		11.6 mm		e4		245	13.5 mm
STA8088GA5TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	8 mm					8 mm
STA260TR	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS					1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B289				Not Qualified
STA311B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel	-40 Cel		QUAD		S-XQCC-N56		1 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
STA8090G	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
SPZB32W1C14	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N25		3.7 mm	16.4 mm					26.5 mm
STA2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B120		1.4 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
MTC20136PQ-I1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G144		4.07 mm	28 mm	Not Qualified				28 mm
SPBT3.0DP2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N18		3 mm	11.6 mm			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SPWF01SC.21	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N25		2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
MTC20455MB-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	BOTTOM		S-PBGA-B160		1.7 mm	12 mm	Not Qualified	e1			12 mm
STLC2500	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified	e1		260	6 mm
E-STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144				Not Qualified	e1
STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B120		1.4 mm	10 mm	Not Qualified	e0			10 mm
STA260-8X8	STMicroelectronics		INDUSTRIAL	BALL	244	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS					1.2,2.5	GRID ARRAY, FINE PITCH	BGA244,18X18,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B241				Not Qualified
STLC2410B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B132		1.2 mm	8 mm	Not Qualified	e1			8 mm
STA8090FGTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8058	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
STA8090EXGAJDTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
SPBT2563C2A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	33		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X33				Not Qualified
STA260	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS					1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B289				Not Qualified
STLC2500A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified				6 mm
SPWF01SC.11	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N25		2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
STA240	STMicroelectronics		INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS					1.2,3.3	GRID ARRAY	BGA288,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B288				Not Qualified
STA5620TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			.019 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
STA8058ATR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
STA2500DC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B48		1.25 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
STLC60243	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		-5 V		5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e0			9.7 mm
STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B144				Not Qualified
LRIS64K-SBN18I/2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL											.15 mA	2 V	2		WAFER	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
E-STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B676	3			Not Qualified	e1
E-STLC60243	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e3/e4	NOT SPECIFIED	NOT SPECIFIED	9.7 mm
SN250QT	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
SPZB32W1A1.1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	26		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N26		3.925 mm	16.4 mm					26.5 mm
STA5630ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
SPWF01SA.21	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N25		2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.