INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF24L01P-R	Nordic Semiconductor Asa		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES						3 V	3	CHIP CARRIER	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQCC-N20				Not Qualified	e3	30	260
RN42-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm		e4			25.8 mm
CC1125RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
HTRC11001T/02EE,11	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.01 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1		4 mm	Not Qualified	e4	30	260	8.75 mm
EQCO62R20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
AD9364BBCZREEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1	30	260	10 mm
SIM7600G-H	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	136	XMA	SQUARE	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	150 Mbps	S-XXMA-N136
NRF24L01P-T	Nordic Semiconductor Asa		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES						3 V	3	CHIP CARRIER	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20				Not Qualified
453-00006	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	39		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.75 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N39	4	2.33 mm	10 mm			30	260	14 mm
WL1837MODGIMOCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
BG96MA-128-SGN	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	102		RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N102		2.3 mm	22.5 mm					26.5 mm
SX1276IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm	Not Qualified	e3		260	6 mm
CC430F5137IRGZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
SN65DSI83TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
BMD-300-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N	3						250
MAX5980GTJ+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
ESP-WROOM-02	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.9 mm	18 mm			30	250	20 mm
XB3-24Z8PT-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20						NOT SPECIFIED	NOT SPECIFIED
CMWX1ZZABZ-093	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	METAL	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-MXMA-N
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm		e4			29.9 mm
RN41SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm		e4			25.8 mm
NRF52840-QIAA	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B73	2	.85 mm	7 mm					7 mm
MAX-M8Q-0	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm					10.1 mm
HMC624ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N24	1	.9 mm	4 mm		e3		260	4 mm
BM70BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
CC1190RGVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	2.5/3.3	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
SN65DSI84TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
MAX-M8Q-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.7 mm	9.7 mm					10.1 mm
DWM1000	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1		CMOS					MICROELECTRONIC ASSEMBLY			1.4 mm	85 Cel	-40 Cel		UNSPECIFIED	6.8 Mbps	R-XXMA-N24		3.15 mm	13 mm			NOT SPECIFIED	NOT SPECIFIED	23 mm
AX5043-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.125 Mbps	S-XQCC-N28	1	1 mm	5 mm			30	260	5 mm
BGM111A256V21R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES						3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.2 mm	12.9 mm					15 mm
CC1120RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
SA612AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4		260	4.9 mm
XCC2642R1FRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
CC2642R1FRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
SX1509BIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.6 mm	4 mm		e3		260	4 mm
SA612AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
BLUENRG-M2SA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	23	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N23		2.5 mm	11.5 mm			20	240	13.5 mm
SL3S4011FHK,125	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES							1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N8	1			Not Qualified		30	260
TESEO-LIV3F	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.3 mm	9.7 mm			NOT SPECIFIED	NOT SPECIFIED	10.1 mm
TLV320AIC3104IRHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	NOT SPECIFIED	260	5 mm
DWM1001C	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34	DMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		DUAL	6.8 Mbps	R-XDMA-N34		3.4 mm	19.13 mm					26.12 mm
NEO-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm					16 mm
SIM800F	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.0856 Mbps	S-XQMA-N68
SX1272IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	1 mm	6 mm		e3	30	260	6 mm
BMD-350-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.35 mm	6.4 mm					8.65 mm
SPSGRF-868	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
ZED-F9P-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	LGA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100		3 V		GRID ARRAY			1.1 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N54		2.6 mm	17 mm					22 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.