INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
WL1837MODGIMOCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
BGT24LTR11N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-PBCC-B16	1	.77 mm	2.4 mm			e3			2.4 mm
XB3-24Z8UT-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20							NOT SPECIFIED	NOT SPECIFIED
ADL5350ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1					3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified		e3		260	3 mm
BGM111A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.1 mm	12.9 mm						15 mm
WT12-A-AI4	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.6 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
SIM7000G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
ESP32-U4WDH	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,20SQ,14		.35 mm	105 Cel	-40 Cel		QUAD	150 Mbps	S-XQCC-N48		.9 mm	5 mm						5 mm
WT12-A-AI3	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N31		2.6 mm	14 mm						25 mm
BM70BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
ZOE-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B51	3	1.165 mm	4.5 mm				NOT SPECIFIED	NOT SPECIFIED	4.5 mm
ODIN-W260-05B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52		3.2 mm	14.8 mm						22.3 mm
ZOE-M8Q-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51	XMA	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N51	3	1.165 mm	4.5 mm						4.5 mm
ISP1507-AX-RS	Insight Sip	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	62	XMA	SQUARE	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N62			8 mm						8 mm
BMD-340-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N68		1.9 mm	10.2 mm						15 mm
BM70BLES1FC2-0B03AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
CC2640R2FRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
LEA-M8S-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28	4	2.7 mm	17 mm						22.4 mm
TLV320AIC3104IRHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
CC2640R2FRSMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N32	3	1 mm	4 mm			e4	30	260	4 mm
L76L-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm						10.1 mm
EQCO62R20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16		1 mm	4 mm			e4			4 mm
SIM7070G	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	1.119 Mbps	S-XQMA-N68
CC2500RGP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.25 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
CC2640R2FRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
L76-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		HEIGHT CAPTURED NOMINAL				10.1 mm
BLUENRG-M2SP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N20		2.5 mm	11.5 mm				20	240	13.5 mm
SIM7000E	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.375 Mbps	S-XQMA-N68
EQCO62T20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm			e4	30	260	4 mm
NCH-RSL10-101S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH	MODULE,51LEAD(UNSPEC)		.7 mm	85 Cel	-40 Cel		UNSPECIFIED	4 Mbps	R-PBGA-B51	3	1.56 mm	6 mm				NOT SPECIFIED	260	8 mm
BGM113A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36		2 mm	9.15 mm						15.73 mm
ANNA-B112-01B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		SQUARE	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N52	3	1.25 mm	6.5 mm						6.5 mm
XB3-24Z8ST-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		X-XDMA-T20							NOT SPECIFIED	NOT SPECIFIED
NEO-M8U-06B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
LBCA2HNZYZ-711	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1					2.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37	3	1 mm	7 mm						7.4 mm
TCA8418RTWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	.8 mm	4 mm	Not Qualified		e4	30	260	4 mm
MRF24J40MA-I/RM	Microchip Technology		INDUSTRIAL		12			PLASTIC/EPOXY							3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,12LEAD,.7	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
CC2640R2FRSMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N32	3	1 mm	4 mm			e4	30	260	4 mm
WT12-A-AI5	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.1781 Mbps	R-XXMA-N31		2.6 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
HTRC11001T/03EE,11	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.01 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1		4 mm	Not Qualified		e4	30	260	8.75 mm
NEO-M8T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm
SA636DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
453-00005C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	39		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.75 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N39	4	2.33 mm	10 mm				30	260	14 mm
BGA524N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm			e3			1.1 mm
BMD-330-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N	3							250
CC1200RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
CYBLE-416045-02	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	43		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.9 mm	85 Cel	-40 Cel		UNSPECIFIED	8000 Mbps	R-XXMA-N43	3	2 mm	14 mm						18.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.