Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.9 mm |
8 mm |
e3 |
250 |
8 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.02 Mbps |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N56 |
1.4 mm |
6.5 mm |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N56 |
1.4 mm |
6.5 mm |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N16 |
1 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
64 |
SQUARE |
UNSPECIFIED |
YES |
1 |
LCC64(UNSPEC) |
QUAD |
S-XQCC-N64 |
Operates from 4.1V to 5.5V Supply |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4250 Mbps |
S-XQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
40 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e0 |
240 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e0 |
240 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
e4 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
110 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
e4 |
NOT SPECIFIED |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||
Cml Microcircuits |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.4 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e3 |
20 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
52 |
QCCN |
RECTANGULAR |
YES |
1 |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
433 Mbps |
R-XQCC-N52 |
2.05 mm |
13 mm |
SEATED HGT NOMINAL |
16.6 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
52 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
LCC52(UNSPEC) |
85 Cel |
-40 Cel |
QUAD |
433 Mbps |
R-XQCC-N52 |
2.1 mm |
13 mm |
SEATED HEIGHT NOM CONSIDERED |
16.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
52 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
433 Mbps |
R-XXMA-N52 |
2.1 mm |
13 mm |
Seated Hgt-Nom |
16.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N12 |
3.48 mm |
22.86 mm |
33.02 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
SILVER OVER NICKEL |
DUAL |
R-XDMA-N24 |
2.6 mm |
12.2 mm |
e4 |
16 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQCC-N48 |
1 mm |
6 mm |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HTSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
85 Cel |
-40 Cel |
DUAL |
S-XDSO-N14 |
1.05 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HTSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
85 Cel |
-40 Cel |
DUAL |
S-XDSO-N14 |
1.05 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
Not Qualified |
e3 |
40 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.066 Mbps |
S-XQMA-N68 |
||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
4 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
X-XUUC-N4 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||
|
Sierra Wireless |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N20 |
2.3 mm |
9 mm |
9.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
.63 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
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Microchip Technology |
TELECOM CIRCUIT |
NO LEAD |
32 |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
LCC32(UNSPEC) |
85 Cel |
-40 Cel |
QUAD |
.08 Mbps |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
51 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N51 |
2.138 mm |
14.908 mm |
33.864 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
TIN |
QUAD |
S-PQCC-N16 |
1 |
.77 mm |
2.3 mm |
e3 |
2.3 mm |
||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
43 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,43LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N43 |
1.9 mm |
15 mm |
29 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12 Mbps |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
e4 |
30 |
260 |
8 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
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|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.178 Mbps |
R-XXMA-N24 |
2 mm |
9 mm |
50 |
250 |
9.5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.