NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC2640F128RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	NOT SPECIFIED	260	7 mm
RN4678APL-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
RS9113-N00-D1W	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
WF111-E-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	QMA	RECTANGULAR	UNSPECIFIED	YES	1				1.5 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		QUAD	72.2 Mbps	R-XQMA-N33	3	2.3 mm	12 mm				40	260	19 mm
BGM15HA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm			e4			1.9 mm
BGS12PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBCC-N10	1	.4 mm	1.1 mm						1.5 mm
SX1243IULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8	1	.6 mm	2 mm	Not Qualified		e3		260	3 mm
ADTR1107ACCZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1				5 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm	5 mm			e4		260	5 mm
AP22804ASN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm	2 mm			e4	30	260	2 mm
AT86RF215IQ-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
SX1231HIMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.19SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	5 mm	Not Qualified		e3		260	5 mm
ATWILC1000-MR110UB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
HMC773ALC3BTR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N12		.9 mm	2.9 mm				NOT SPECIFIED	NOT SPECIFIED	2.9 mm
MRF24WG0MA-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
PN5120A0HN/C2,551	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified		e4	30	260
NEO-M8T	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N24							NOT SPECIFIED	NOT SPECIFIED
RN41N-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm			e3			20.1 mm
SPSGRF-915	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1				5 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm	5 mm			e4		260	5 mm
CC430F6137IRGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
EC21AFA-512-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N		2.4 mm	29 mm		SEATED HEIGHT NOM				32 mm
MAX7042ATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0086 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX7042ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0092 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
SE2431L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N24	1	.9 mm	3 mm	Not Qualified				260	4 mm
SKY66111-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N20	3	.9 mm	3 mm					260	3.3 mm
SL2S2002FTB	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm	Not Qualified		e3	30	260	1.45 mm
XCC3135MODRNMMOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N63		2.45 mm	17.5 mm						20.5 mm
XCC3235MODSM2MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N63		2.45 mm	17.5 mm						20.5 mm
ADL5391ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm	Not Qualified		e3	30	260	3 mm
ATA8510-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.046 mA	3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm	Not Qualified		e3			5 mm
BM832	Fanstel	TELECOM CIRCUIT		NO LEAD	47	LGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY				85 Cel	-40 Cel		BOTTOM	8 Mbps	R-XLGA-N47		1.95 mm	10.2 mm						15 mm
LMX9838SBX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.065 mA	3.3 V	3.3	GRID ARRAY	LGA70(UNSPEC)	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-N70	4	2.1 mm	10 mm	Not Qualified			30	250	17 mm
LNBH26LPQR	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N24		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
ATA8210-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
ATA8215-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
GS2988-INE3	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N16	3	.9 mm	4 mm			e3	40	260	4 mm
LMX9838SB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-N70		2.1 mm	10 mm	Not Qualified		e0			17 mm
LTC5596IDC#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm	2 mm			e3			2 mm
XB3-24Z8US	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37
EYAGJNZXX	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			.4 mm	75 Cel	-25 Cel		UNSPECIFIED		R-XXMA-N28		1.5 mm	5.1 mm				NOT SPECIFIED	NOT SPECIFIED	11.3 mm
FC20-Q93	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR		YES	1				3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD	433 Mbps	R-XQCC-N52		2.05 mm	13 mm		SEATED HGT NOMINAL				16.6 mm
MAX3799ETJ+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm			e3	30	260	5 mm
RFFC5072TR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
SARA-G450-00C-00	U-blox Ag	TELECOM CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N96		2.65 mm	16 mm						26 mm
AP22814BSN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm	2 mm			e4	30	260	2 mm
BM71BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-X16		2.1 mm	9 mm						11.5 mm
CC2538SF53RTQR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm			e4	30	260	8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.