NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN4678APL-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
WT32I-A-AI6-APTX	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50	3	2.55 mm	15.9 mm			40	260	23.9 mm
CC2541F256TRHATQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
EVA-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	43	XMA	SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N43		1.16 mm	7 mm					7 mm
ST7580	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		.03 mA	13 V	13	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
XB3-24Z8US-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37						NOT SPECIFIED	NOT SPECIFIED
AFE031AIRGZT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			.0053 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	NOT SPECIFIED	260	7 mm
CC2564CRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm		e3	30	260	8 mm
BGM113A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel		UNSPECIFIED				2 mm	9.15 mm					15.73 mm
RS9116W-SB00-B00	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	126	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N126
BMD-340-A-R-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N68		1.9 mm	10.2 mm					15 mm
CC2564BRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm	7.73 mm		e3	30	260	8 mm
ETRX357-LRS	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	DMA	RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33			19 mm					25 mm
EM357-RTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
MRF24J40ME-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm					33.02 mm
TRF7970ARHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
MRF39RAT-I/LY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	5 mm					5 mm
CLRC66302HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
HMC1122LP4METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.95 mm	4 mm					4 mm
WT32I-A-AI6IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm	15.9 mm			NOT SPECIFIED	NOT SPECIFIED	23.9 mm
BLUENRG-MSQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm					5 mm
CYBLE-214015-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32	3	1.8 mm	11 mm					11 mm
SX1278IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm	Not Qualified	e3		260	6 mm
BMD-330-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm					14 mm
CC1175RHMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified	e4	30	260	5 mm
AS3933-BQFT	Ams Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16	3	.9 mm	4 mm				260	4 mm
BM23SPKS1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm					29 mm
CC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm		e3			7 mm
CC430F5135IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
MAX-M8W-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	2.5 mm					10.1 mm
SIM900D	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	XMA	SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.0856 Mbps	S-XXMA-N48
NEO-M8U-05B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm					16 mm
XB3-24Z8RM-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N34			13 mm			NOT SPECIFIED	NOT SPECIFIED	19 mm
ZM5202AE-CME3R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel		QUAD	.1 Mbps	R-XQMA-N18			12.5 mm					13.6 mm
BM71BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm					8 mm
CC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm		e3			7 mm
RN4870U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N30		1.6 mm	12 mm					15 mm
TUSB211RWBR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm		e4	30	260	1.6 mm
BGM121A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm					6.5 mm
CC2564CRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	4 Mbps	S-XQCC-N76	3	.9 mm	8 mm		e3	30	260	8 mm
CC2640F128RSMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	3	1 mm	4 mm		e4	NOT SPECIFIED	260	4 mm
MFRC63102HN,151	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	.4 Mbps	S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
RS9116W-SB00-B00-X23	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	126	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N126	3					40	260
USB3740B-AI9-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		5 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-PQCC-N10		.6 mm	1.6 mm		e4			2.1 mm
USB3740B-AI9TR	Standard Microsystems	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N10		.6 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	2.1 mm
NEO-M8P-2-11	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm					16 mm
RN4870-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
SL2S2002FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm		e3	30	260	1.45 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.