NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LXMS33HCNG-134	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		VSON	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel		DUAL		S-PDSO-N		.7 mm	3.2 mm				NOT SPECIFIED	NOT SPECIFIED	3.2 mm
SC1894A-00C13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		.9 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
SST12LF02-QXCE	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N16		.5 mm	3 mm			e3			3 mm
WYSBHVGXG	Taiyo Yuden	TELECOM CIRCUIT	OTHER	NO LEAD	70		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N70		1.9 mm	8.9 mm				NOT SPECIFIED	NOT SPECIFIED	12.6 mm
XB9X-DMUS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
AX-SFEU-1-03-TX30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N40		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
BGS14PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1		CMOS		2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N10	1	.4 mm	1.1 mm						1.5 mm
CC2530F32RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
HPA00399RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm			e4	30	260	5 mm
LMX2571NJKR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N36	3	.8 mm	6 mm			e3	30	260	6 mm
M66FA-04-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N44		2.3 mm	17.7 mm						15.8 mm
PN5120A0HN/C2,557	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified		e4	30	260
SI4455-B1A-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.9 mm	3 mm			e3	40	260	3 mm
SIM5320A	Simcom Wireless Solutions	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	80	QMA	SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				80 Cel	-30 Cel		QUAD	3.6 Mbps	S-XQMA-N80
XB3-24Z8CM	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N34			13 mm						19 mm
ADL5904ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm			e4	30	260	3 mm
AP22804BSN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm	2 mm			e4	30	260	2 mm
AT86RF215IQ-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
DNT24C	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N30			24.9 mm				NOT SPECIFIED	NOT SPECIFIED	38.1 mm
EC21EUGA-512-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	10 Mbps	R-XXMA-N144		2.4 mm	29 mm		SEATED HEIGHT NOM				32 mm
EYSGCNZWY	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-25 Cel		UNSPECIFIED		R-XXMA-N49		2.2 mm	9.6 mm				NOT SPECIFIED	NOT SPECIFIED	12.9 mm
HMC566LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
XB3-24Z8PS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37							NOT SPECIFIED	NOT SPECIFIED
ATWILC1000-MR110PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
HMC1094LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm			e3	30	260	3 mm
PE4312MLBA-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e4	30	260	4 mm
SKY66110-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N20	3	.9 mm	3 mm					260	3.3 mm
TRF37B32IRTVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	2	.8 mm	5 mm		RF frequency(Min)(MHz) is 700; RF frequency(Max)(MHz) is 2700	e4	30	260	5 mm
CC2531F256RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
L70B-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		SEATED HGT-NOM; OPERATED WITH 2.8V TO 4.3V				10.1 mm
SE2604L-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N16		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
XB9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
AD9864BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.02 Mbps	S-XQCC-N48	3	1 mm	7 mm			e3	30	260	7 mm
AT86RF231-ZUR	Microchip Technology		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS			1.8,3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32				Not Qualified		e3
ATWILC1000-MR110PB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
BGM123A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
BMD-360-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47	3	1.9 mm	9.8 mm					250	14 mm
CC2430ZF128RTCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
HMC566LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm			e3	30	260	4 mm
HMC773ALC3B	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TUNGSTEN NICKEL GOLD	QUAD		S-CQCC-N12	3	.92 mm	3 mm					260	3 mm
LTC5800IWR-IPMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	SILVER	QUAD		S-PQCC-N72		1 mm	10 mm			e4			10 mm
PE42423MLBA-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm			e4			3 mm
ATSAMW25H18-MR510PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ESP8285H16	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32	3	.9 mm	5 mm			e3	30	250	5 mm
MRF24WB0MB/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified		e3
NRF905	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm	Not Qualified			30	260	5 mm
XB3-24Z8RS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37							NOT SPECIFIED	NOT SPECIFIED
CC2430ZF128RTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.