NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AWL9966RS36P8	Ii-vi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	2	.6 mm	4 mm	Not Qualified				4 mm
BGM113A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36		2.09 mm	9.15 mm					15.73 mm
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
EFR32BG21A010F512IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N32	2	.9 mm	4 mm		e3	40	260	4 mm
HMC1023LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	1 mm	5 mm		e3	30	260	5 mm
MAX-8Q	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N18						NOT SPECIFIED	NOT SPECIFIED
MFRC63002HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
RN41N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm		e3			20.1 mm
RN42N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm		e4			20.5 mm
W2SG0084I-B-T	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N24	1	2.3 mm	11.2 mm				245	12 mm
XBP9X-DMRS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
ADRF6821ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e4	30	260	8 mm
ATA5746-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm	Not Qualified				5 mm
ATSAMW25H18-MR210PB1952	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm					33.864 mm
CC1121RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC2564BRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm	7.73 mm		e3	30	260	8 mm
CC430F6137IRGC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm	Not Qualified	e4	30	260	9 mm
ENW89837A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	58		RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N58		2 mm	8.7 mm			10	250	15.6 mm
ETRX2-PA	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N38			20.5 mm					37.5 mm
HT2DC20S20/F/RSP	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID					SPECIAL SHAPE	MODULE(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	SILVER	UNSPECIFIED		R-PXSS-N				Not Qualified	e4
MAX2851ITK+	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N68	3	.8 mm	10 mm	Not Qualified	e3	30	260	10 mm
MAX3658AETA-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX3658AETA+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MC12311CHN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	LGA	SQUARE	PLASTIC/EPOXY	YES							2/3.3	GRID ARRAY	LGA60,16X16,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-PBGA-N60	3			Not Qualified	e4	40	260
MFRC63002HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm					5 mm
MFRC63002HN,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
PE42426A-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N12	1	.8 mm	3 mm		e4	30	260	3 mm
RFFC5072SR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
RN42U-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			NOT SPECIFIED	NOT SPECIFIED	25.8 mm
SC1894A-00M13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		.9 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
SL2S2102FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm		e3	30	260	1.45 mm
SX1509QBIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N28		.6 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ADL5240ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
ADRF6821ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e4	30	260	8 mm
AS3911-BQFT	Ams Ag	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				12.5 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified				5 mm
BM78SPP05MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N30		1.86 mm	12 mm		e4	40	255	15 mm
CYBLE-012011-00	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31	3	2 mm	14.52 mm					19.2 mm
HMC862ALP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm		e3	30	260	3 mm
LMX2571NJKT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N36	3	.8 mm	6 mm		e3	30	260	6 mm
PN5120A0HN/C2,518	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES							1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified	e4	30	260
RFFC5072TR7	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
SC1894A-00C13	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		.9 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
SC1894A-00M13	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		.9 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
SKY66112-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N22	3	1.1 mm	3 mm		e4		260	3.5 mm
TUSB211QRWBRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm		e4	30	260	1.6 mm
XBP9X-DMUS-011	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
450-0152C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47	4	2.14 mm	15.5 mm				245	21 mm
ADMV4801BCCZ	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	LGA	SQUARE	UNSPECIFIED	YES	1							GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-XBGA-N72	3					30	260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.