NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC641ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	1			-3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24		.95 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
451-00002	Laird Technologies	TELECOM CIRCUIT		NO LEAD	71	XMA	RECTANGULAR	UNSPECIFIED		YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N71		2.35 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	15 mm
PN5321A3HN/C106	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm			e4	30	260	6 mm
HMC773ALC3BTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N12	3	.92 mm	3 mm			e4			3 mm
LTC5596IDC#TRMPBF	Analog Devices	TELECOM CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY		YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			MATTE TIN	DUAL		S-PDSO-N8		.8 mm	2 mm			e3			2 mm
SI4432-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
CC2640F128RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	3	1 mm	5 mm			e4	NOT SPECIFIED	260	5 mm
MD0101K6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	18	HVSON	SQUARE	PLASTIC/EPOXY		YES	1							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC18,.20SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N18		1 mm	5 mm	Not Qualified		e4			5 mm
8265.NGWMG.NV	Intel	TELECOM CIRCUIT		NO LEAD		SMA	RECTANGULAR	UNSPECIFIED		NO	1							MICROELECTRONIC ASSEMBLY				80 Cel	0 Cel		SINGLE	867 Mbps	R-XSMA-N
ATWILC1000-MR110UB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
BGM15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm						1.9 mm
CLRC66302HN,157	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1 Mbps	S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
ETRX357	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED		NO	1					3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33	3		19 mm				40	250	25 mm
RS9116W-DB00-CC1-X11	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	107	LGA	RECTANGULAR	UNSPECIFIED		YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N107
450-0064	Ls Research	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED		YES	1					3.6 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52	4	1.9 mm	13 mm						18 mm
CC430F5135IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
WT32I-A-AI6	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED		YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm	15.9 mm				NOT SPECIFIED	NOT SPECIFIED	23.9 mm
CC1175RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
CC2640F128RSMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	3	1 mm	4 mm			e4	NOT SPECIFIED	260	4 mm
CYBLE-224116-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.76 mm	105 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N32	3	1.9 mm	9.5 mm						15.4 mm
NEO-M8P-0-11	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED		NO	1		AEC-Q100; TS 16949			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
NRF905-REEL	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm	Not Qualified					5 mm
BG95M5LA-64-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	102	LGA	RECTANGULAR	UNSPECIFIED		YES	1					3.8 V		GRID ARRAY	LGA102(UNSPEC)			75 Cel	-35 Cel		BOTTOM	1.119 Mbps	R-XBGA-N102		2.2 mm	19.9 mm						23.6 mm
CC1175RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
RN41-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES	1		TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm			e4			25.8 mm
BLE113-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED		YES	1							MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36	3	2.09 mm	9.15 mm		Operates from 2V to 3.6V supply		40	260	15.725 mm
RN4870-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
ZM3102AE-CME1	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED		YES	1							MICROELECTRONIC ASSEMBLY							UNSPECIFIED	.04 Mbps	R-XXMA-N18
BGT24MTR12E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	1	BIPOLAR				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm			e3			5.5 mm
MDBT50Q-P1MV2	Raytac	TELECOM CIRCUIT		NO LEAD	61	XMA	RECTANGULAR	UNSPECIFIED		YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N61		2 mm	10.5 mm						15.5 mm
PN5120A0HN1/C1,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
XBP9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED		YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
MAX24287ETK+T	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	SONET	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N68		.8 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX5980GTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	CMOS						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-CQCC-N32	1	.8 mm	5 mm			e3	30	260	5 mm
CC2640F128RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	3	1 mm	5 mm			e4	NOT SPECIFIED	260	5 mm
CC2531F256RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC2592RGVR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm			e4	30	260	4 mm
HMC799LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY		YES	1				80 mA	5 V	5	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1			Not Qualified		e3	30	260
AT86RF215M-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
BGM121A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED		YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm	6.5 mm						6.5 mm
CLRC66301HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
CYBT-353027-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	19		SQUARE	UNSPECIFIED		YES	1							MICROELECTRONIC ASSEMBLY			1.05 mm	85 Cel	-30 Cel		UNSPECIFIED		S-XXMA-N19	3	1.75 mm	9 mm						9 mm
AT86RF215-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
AT86RF215M-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
UBX-M8030-KT	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED		YES	1		AEC-Q100			3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N40	1
HTSH5601ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY		YES	1							SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel		DUAL		R-PDSO-N2	1			Not Qualified			30	260
RFFC2071ATR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm						5 mm
PN5120A0HN1/C1,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.