Infineon Technologies Other Function Telecom Interface ICs 1,022

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CY7B9233-270JC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

BICMOS

160 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J28

Not Qualified

e0

CYBL21572-56LQXI

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.6 mm

7 mm

7 mm

CYW20713A1KUBG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW4334WKWBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

208

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B208

.33 mm

4.08 mm

4.48 mm

CYBT-413055-02

Infineon Technologies

TELECOM CIRCUIT

3

CYW20702B0KWFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.8 mm

4 mm

4.5 mm

CYW4356XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

192

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B192

.55 mm

4.87 mm

7.67 mm

CYW20730A2KML2G

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

CYW4354XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

192

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B192

.55 mm

4.87 mm

7.67 mm

CYBLE-413124-01

Infineon Technologies

TELECOM CIRCUIT

CYW20738A2KML3G

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

6 mm

CYBL21573-56LQXQ

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N56

.6 mm

7 mm

7 mm

CYW4343W1KUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20732A0KML2G

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

CY7B923-400JXCT

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.085 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

400 Mbps

S-PQCC-J28

3

4.572 mm

11.5316 mm

Not Qualified

e3

20

260

11.5316 mm

CYW20702A1KWFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.8 mm

4 mm

4.5 mm

CYW43143KMLGT

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

65 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N56

3

.9 mm

7 mm

e4

30

260

7 mm

CYBT-423054-02

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

28

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.91 mm

85 Cel

-30 Cel

UNSPECIFIED

3 Mbps

S-XXMA-N28

3

1.7 mm

11 mm

SEATED HGT-NOM

11 mm

CYW20737L

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

LGA

SQUARE

UNSPECIFIED

YES

1

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-N48

3

1.18 mm

6.5 mm

e1

6.5 mm

CYW4343SKUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20705A1KWFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.8 mm

4 mm

4.5 mm

CYW4373IUBGT

Infineon Technologies

TELECOM CIRCUIT

BALL

128

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA128,11X13,16

.4 mm

70 Cel

-20 Cel

BOTTOM

480 Mbps

R-PBGA-B128

.6 mm

4.51 mm

5.43 mm

CYW4343WKWBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

70 Cel

-30 Cel

BOTTOM

R-PBGA-B153

.33 mm

2.87 mm

4.87 mm

CY7B933-400JXCT

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.155 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

400 Mbps

S-PQCC-J28

3

4.572 mm

11.5316 mm

Not Qualified

e3

20

260

11.5316 mm

CYW20719B2KUMLGT

Infineon Technologies

TELECOM CIRCUIT

PURE TIN

3

CYW20819A1KFBG

Infineon Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CYW20745A0KFBG

Infineon Technologies

TELECOM CIRCUIT

CYW20730A1KFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B64

1 mm

7 mm

7 mm

CYW20730A2KFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B64

1 mm

7 mm

7 mm

CYW43364KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW4356XKWBG

Infineon Technologies

CYW20745A0KMLGT

Infineon Technologies

TELECOM CIRCUIT

CYW20715A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW20730A2KMLG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

6 mm

CYW20713

Infineon Technologies

TELECOM CIRCUIT

CYW4339XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

145

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B145

.55 mm

4.87 mm

5.413 mm

CYBLE-013025-00

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N31

3

2.25 mm

14.52 mm

19.2 mm

CYW43340HKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

141

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B141

.55 mm

4.47 mm

5.67 mm

CYW4343W1KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20736A1KWBGT

Infineon Technologies

TELECOM CIRCUIT

TIN SILVER

1

e2

CYBL21172-56LQXI

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.6 mm

7 mm

7 mm

CYW43732XKUBGT

Infineon Technologies

TELECOM CIRCUIT

CYBT-223058-02

Infineon Technologies

TELECOM CIRCUIT

3

NOT SPECIFIED

NOT SPECIFIED

CYW20733A3KFB1G

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

81

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B81

1.1 mm

8 mm

8 mm

CY7B4663

Infineon Technologies

CYW20732YB3ISLGHT

Infineon Technologies

TELECOM CIRCUIT

MILITARY

BUTT

27

RECTANGULAR

UNSPECIFIED

YES

1

1.2 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

UNSPECIFIED

R-XXMA-B27

.96 mm

3.2 mm

3.5 mm

CYW43012TC0EKUBG

Infineon Technologies

TELECOM CIRCUIT

CYBT-423060-02

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

28

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.91 mm

85 Cel

-30 Cel

UNSPECIFIED

3 Mbps

S-XXMA-N28

3

1.7 mm

11 mm

SEATED HGT-NOM

11 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.