Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SP001140088

Infineon Technologies

TELECOM CIRCUIT

SLE95050H

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.55 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

110 Cel

-20 Cel

QUAD

S-PQCC-N6

.8 mm

2.5 mm

2.5 mm

SP000056182

Infineon Technologies

TELECOM CIRCUIT

TDK5111F

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.021 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

TDK5101PBF

Infineon Technologies

TELECOM CIRCUIT

TDK5100FXT

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

125 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

TDK5110XT

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

5 mm

TDK5100F

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

2.1/4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

260

3 mm

SP000531308

Infineon Technologies

TELECOM CIRCUIT

TDK5111

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0195 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

260

5 mm

SP000300415

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.05 mm

3 mm

3 mm

TLE6255

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

4 mm

Not Qualified

8.75 mm

SP000550860

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

9.7 mm

TDK5110

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.019 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

e3

260

5 mm

TDK5101

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0095 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

260

5 mm

SP001140086

Infineon Technologies

TELECOM CIRCUIT

TDK5111XT

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

5 mm

SLB9635TT1.2F

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

9.7 mm

TDK5101FTDA52

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

125 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

3 mm

SDA6310X

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

12 V

12

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

2.65 mm

7.6 mm

Not Qualified

e0

12.8 mm

SP000013532

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

5 mm

SP001068580

Infineon Technologies

TELECOM CIRCUIT

SDA6310

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

12 V

12

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

e0

SP001109130

Infineon Technologies

TELECOM CIRCUIT

TDK5116FHTMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

3 mm

TDK5111FHTMA2

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

e3

3 mm

TDK5100

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0095 mA

3 V

2.1/4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

e3

260

5 mm

TDK5101F

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

SP000507672

Infineon Technologies

TELECOM CIRCUIT

BGS13GA14E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

S-XBCC-B14

.65 mm

2 mm

e4

2 mm

BGS17GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

GOLD NICKEL

QUAD

S-XQMA-B14

1

.65 mm

2 mm

e4

2 mm

BGSA402ML10

Infineon Technologies

BGS16MN14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

Tin (Sn)

QUAD

S-PQCC-N14

1

.77 mm

2 mm

e3

NOT SPECIFIED

NOT SPECIFIED

2 mm

TDA5101A

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

TIN LEAD

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

e0

3 mm

TLE8457BLE

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

8

HTSON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

.65 mm

TIN

DUAL

S-PDSO-N8

2A

1.15 mm

3 mm

e3

3 mm

BGSA141MN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

1

BGSA143ML10

Infineon Technologies

TELECOM CIRCUIT

1

TDA5255E1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

9.7 mm

BGSA141MN10

Infineon Technologies

TELECOM CIRCUIT

1

BGM15HA12E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N12

.65 mm

1.1 mm

1.9 mm

TDA5255XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

9.7 mm

TDA5101XUMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

5 mm

BGSA12UGL8

Infineon Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

TDA5251

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

260

9.7 mm

TLE8457ALE

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

8

HTSON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

.65 mm

TIN

DUAL

S-PDSO-N8

2A

1.15 mm

3 mm

e3

3 mm

BGS12SN6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.6 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

Tin (Sn)

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

e3

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

TDA7110

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

260

5 mm

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

.32 mm

.7 mm

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.