Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

V23846-P1511

Infineon Technologies

PEB80900F

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

V23845-D4412

Infineon Technologies

PMB2401T

Infineon Technologies

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

.03 mA

5 V

5

SMALL OUTLINE

SOP28,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

Not Qualified

e0

PMB2400

Infineon Technologies

OTHER

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

33 mA

5 V

5

SMALL OUTLINE

SOP24,.3

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

V23845-M1311

Infineon Technologies

V23845-M1121

Infineon Technologies

V23845-M1112

Infineon Technologies

PSF2115H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

DM208

Infineon Technologies

BGM704N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N7

.4 mm

1.3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2 mm

PMB2900-H

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-25 Cel

QUAD

S-PQFP-G64

Not Qualified

PSB2110-P

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

5 V

5

IN-LINE

DIP40,.6

Digital Transmission Interfaces

2.54 mm

70 Cel

4.5 V

.45 V

CCITT I.411

0 Cel

TIN LEAD

DUAL

.064 Mbps

R-PDIP-T40

R

5.1 mm

15.24 mm

Not Qualified

7 Amp

e0

50.9 mm

V23846-P4312

Infineon Technologies

V23845-M1512

Infineon Technologies

PEB2075C

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC

NO

CMOS

10 mA

5 V

5

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T28

Not Qualified

e0

V23845-D1511

Infineon Technologies

V23809-E1-E30

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

FLAT

51

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

0 Cel

UNSPECIFIED

R-XXMA-F51

Not Qualified

BGT60E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT

BALL

119

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

BOTTOM

S-PBGA-B119

.8 mm

6 mm

6 mm

V23845-D1312

Infineon Technologies

PMB2920-S

Infineon Technologies

TELECOM CIRCUIT

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G24

Not Qualified

V23845-D1431

Infineon Technologies

ICE5AR4770AG

Infineon Technologies

TELECOM CIRCUIT

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

18 V

SMALL OUTLINE

SOP12,.25

1.27 mm

150 Cel

-40 Cel

DUAL

R-PDSO-G12

3

1.75 mm

3.9 mm

9.9 mm

V23845-M1321

Infineon Technologies

PEF2256EV2.2-G

Infineon Technologies

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

145 mA

1.8,3.3

GRID ARRAY

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

T-1(DS1)

CEPT PCM-30/E-1

Not Qualified

PBM99080/22LG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

78

VFLGA

SQUARE

UNSPECIFIED

YES

1

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B78

1 mm

8 mm

Not Qualified

8 mm

PEF2256EV2.2

Infineon Technologies

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

145 mA

1.8,3.3

GRID ARRAY

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

T-1(DS1)

CEPT PCM-30/E-1

Not Qualified

220

PMB2220

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3 V

3.3/5

SMALL OUTLINE

SSOP20,.3

Other Telecom ICs

.635 mm

55 Cel

-10 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

V23845-D4221

Infineon Technologies

V23845-D1621

Infineon Technologies

PMB8753

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

65

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B65

.8 mm

5 mm

Not Qualified

e1

5 mm

V23845-M4611

Infineon Technologies

V23845-D1422

Infineon Technologies

V23845-D1332

Infineon Technologies

V23846-P4222

Infineon Technologies

V23846-P1122

Infineon Technologies

V23845-M4511

Infineon Technologies

V23845-M4221

Infineon Technologies

Q67227H1099

Infineon Technologies

V23845-M4632

Infineon Technologies

IRM6000

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

MICROELECTRONIC ASSEMBLY

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSMA-X8

Not Qualified

e0

PEB3035-P

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.008 mA

5 V

IN-LINE

DIP28(UNSPEC)

Other Telecom ICs

2.54 mm

85 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T28

4.6 mm

15.24 mm

Not Qualified

e0

35.9 mm

BGT24MTR11

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

PSB4501-T

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

140 mA

1.6/7.5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

PEB3554

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

FLATPACK

.65 mm

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEB8191H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

BASIC

FLATPACK

QFP64,.66SQ,32

Digital Transmission Interfaces

.8 mm

70 Cel

2.4 V

.45 V

ANSI T1.601

0 Cel

TIN LEAD

QUAD

.192 Mbps

S-PQFP-G64

S/T TO U (NT-1)

Not Qualified

7 Amp

e0

PSB21381

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

e0

10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.