Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

PSB4506A-P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

3.5/9.2

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

V23845-D1612

Infineon Technologies

V23845-D1211

Infineon Technologies

V23845-M4312

Infineon Technologies

PEB2055-C

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

CMOS

9.5 mA

5 V

5

IN-LINE

DIP40,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T40

Not Qualified

e0

PSB2113H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.019 mA

5 V

5

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

e0

14 mm

V23845-D1132

Infineon Technologies

BGA7H1N6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

e3

1.1 mm

PMB2247-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

PEB2055A2P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

5 V

5

IN-LINE

DIP40,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T40

Not Qualified

e0

V23845-M1421

Infineon Technologies

V23845-D4312

Infineon Technologies

BGA751N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

2 mm

V23845-M4212

Infineon Technologies

PBA31305

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

36

LLGA

SQUARE

UNSPECIFIED

YES

1

CMOS

2.6 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-20 Cel

BOTTOM

S-XBGA-B36

1.6 mm

8.8 mm

Not Qualified

8.8 mm

V23846-P4212

Infineon Technologies

V23845-D4411

Infineon Technologies

V23845-M4512

Infineon Technologies

PEB2056-P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

BGSX44MA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B12

1

.65 mm

1.6 mm

1.6 mm

PEF2023T

Infineon Technologies

TELECOM CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G14

Not Qualified

PEF21624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PEF8191

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

V23845-D4112

Infineon Technologies

V23845-D1221

Infineon Technologies

PSB4506A

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

60 mA

3.5/9.2

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

BGT24LTR11N16

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

16

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBCC-B16

1

.77 mm

2.4 mm

2.4 mm

BGT24AT2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

PMB2230-S

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

13.2 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

PMB2407-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

PSB4595V2.1

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

9.7 mm

V23845-D1632

Infineon Technologies

PEF24624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

V23845-M4211

Infineon Technologies

PEB2041N

Infineon Technologies

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

Not Qualified

e0

PSB2115F-V12

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

V23845-D1212

Infineon Technologies

PEB2045-PVA3

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

5 V

5

IN-LINE

DIP40,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T40

Not Qualified

e0

PEF2075-N

Infineon Technologies

TELECOM CIRCUIT

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER

1.27 mm

QUAD

S-PQCC-J44

4.57 mm

16.6 mm

Not Qualified

16.6 mm

PSB21150HV1.4

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

3

2.45 mm

14 mm

220

14 mm

V23846-P1321

Infineon Technologies

LH2559AAC-TR

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G8

2.13 mm

5.59 mm

Not Qualified

5.715 mm

PBM99090

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

96

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B96

Not Qualified

BGT24MTR12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

S042E

Infineon Technologies

COMMERCIAL

WIRE

10

ROUND

METAL

BIPOLAR

2.9 mA

12 V

12

CYLINDRICAL

CAN10,.23

Other Telecom ICs

70 Cel

-15 Cel

Tin/Lead (Sn/Pb)

BOTTOM

O-MBCY-W10

Not Qualified

e0

PEB2070B1P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

IN-LINE

DIP24,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T24

Not Qualified

e0

V23846-P4211

Infineon Technologies

BGA123L4E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

VQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-N4

1

.32 mm

.7 mm

.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.