Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CYW4343WKUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

1

.55 mm

2.87 mm

4.87 mm

BCM4330FKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

144

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B144

1 mm

6.5 mm

6.5 mm

BCM43455XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

140

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B140

.6 mm

4.47 mm

5.27 mm

CYW20721B2KUMLGT

Infineon Technologies

TELECOM CIRCUIT

BGT24ATR11E6433

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-XQCC-N32

.9 mm

4.5 mm

5.5 mm

BGA8V1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

1.1 mm

BGA711N7E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

e3

2 mm

V23845-D1231

Infineon Technologies

V23845-M4412

Infineon Technologies

V23846-P1311

Infineon Technologies

PMB2401-S

Infineon Technologies

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

.03 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Telecom ICs

.635 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

Not Qualified

e0

ICE5GR2280AG

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

PMB2240-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

SLE5002W

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

Not Qualified

e0

V23845-D4132

Infineon Technologies

PSB2168

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G80

2.45 mm

14 mm

Not Qualified

e0

14 mm

PMB2905-F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

V23845-M4121

Infineon Technologies

PTGA090304MD

Infineon Technologies

TELECOM CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G14

2.62 mm

9.02 mm

14.94 mm

PSB7110FV1.0

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.6 V

3.6,5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

e0

14 mm

V23845-M1131

Infineon Technologies

V23845-M1431

Infineon Technologies

PEB2075PV1.3

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

5 V

IN-LINE

70 Cel

0 Cel

DUAL

R-PDIP-T28

Not Qualified

V23845-D4212

Infineon Technologies

PMB2408V1.1

Infineon Technologies

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

51.3 mA

2.7/4.5

FLATPACK

TQFP48,.35SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

Not Qualified

e0

PEF8091H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

BGA8U1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

PEB2445C

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

CMOS

20 mA

5 V

5

IN-LINE

DIP40,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T40

Not Qualified

e0

PMB2727-H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

.65 mm

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEB2075W

Infineon Technologies

COMMERCIAL

J BEND

28

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

10 mA

5 V

5

CHIP CARRIER

LDCC28,.4X.6

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQCC-J28

Not Qualified

e0

V23845-D1112

Infineon Technologies

PSB21150FV14XQMA1

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

40

260

10 mm

IRMS6409

Infineon Technologies

TELECOM CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

SINGLE

R-XSMA-X8

Not Qualified

V23846-P4511

Infineon Technologies

IRMS6419

Infineon Technologies

TELECOM CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

5 V

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

SINGLE

R-XSMA-X8

Not Qualified

PSB21150F

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

BASIC

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Digital Transmission Interfaces

.5 mm

70 Cel

2.4 V

.45 V

CCITT I.430

0 Cel

QUAD

.144 Mbps

S-PQFP-G64

S/T

1.6 mm

10 mm

Not Qualified

4.5 Amp

10 mm

V23846-P1112

Infineon Technologies

V23845-D4322

Infineon Technologies

PSB79C30E-P

Infineon Technologies

V23845-M1612

Infineon Technologies

V23845-M1621

Infineon Technologies

PEB31664V1.3

Infineon Technologies

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

BICMOS

125 mA

3.3 V

3.3

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G64

Not Qualified

e0

V23845-M4421

Infineon Technologies

V23845-D4622

Infineon Technologies

V23846-P4411

Infineon Technologies

V23845-D4522

Infineon Technologies

PSB7110FV1.1

Infineon Technologies

COMMERCIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

3.6,5

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G100

Not Qualified

e0

BGA7H1N6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

e3

1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.