Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TDA7100HTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	-20 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
BGS13SN8E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1	MOS					CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBCC-B8	1	.4 mm	1.1 mm		e3			1.1 mm
BGSA12GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
BGA5H1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGSX44MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT																								1
CYW20706UA2KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B49	3	1.05 mm	4 mm		e1			4.5 mm
TLE8457ALEXUMA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
TLE8457ASJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
CYBLE-212020-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31	3	2 mm	14.52 mm					19.2 mm
CYW20734UA1KFFB3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	90	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		R-PBGA-B90		1.2 mm	8.5 mm					8.5 mm
BGM1032N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
CY7B923-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	30	260	17.905 mm
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm		e3			1.5 mm
BGS13S2N9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	1	MOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBGA-B9	1	.4 mm	1.1 mm		e3			1.1 mm
CY7B923-400JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYBLE-012011-00	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31	3	2 mm	14.52 mm					19.2 mm
BGS16GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBCC-N14	1	.65 mm	2 mm					2 mm
BGSA11GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
CY7C924ADX-AXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.25 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
BGSA13GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-N10	1	.4 mm	1.1 mm					1.5 mm
CYBT-213043-02	Infineon Technologies	TELECOM CIRCUIT																								3					NOT SPECIFIED	NOT SPECIFIED
BGS14GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm		e4			2 mm
CY7B933-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYBT-253059-02	Infineon Technologies	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
TDK5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5110XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
BGS15AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD		S-PQCC-N16	1	.77 mm	2.3 mm		e3			2.3 mm
TDA7116F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified			260	3 mm
TDA7116FXT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
BGS15GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm		e4			2 mm
CYBT-483062-02	Infineon Technologies	TELECOM CIRCUIT																								3					30	260
CYW43438KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B63	1	.55 mm	2.87 mm					4.87 mm
TDA5235XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4			9.7 mm
BGA751N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGS13GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14	1	.65 mm	2 mm		e4			2 mm
CYW43364KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm		e1			4.87 mm
PSB21150FV1.4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G64	3	1.6 mm	10 mm				260	10 mm
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B20	1	.77 mm	2.3 mm					2.3 mm
CYBT-483056-02	Infineon Technologies	TELECOM CIRCUIT																								3					30	260
CYW20736A1KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-30 Cel	PURE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm					5 mm
CY7B933-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	20	260	17.905 mm
CYW43455XKUBGT	Infineon Technologies	TELECOM CIRCUIT		BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA140,11X13,16		.4 mm	85 Cel	-30 Cel		BOTTOM	433.3 Mbps	R-PBGA-B140	1	.6 mm	4.47 mm					5.27 mm
BGM1033N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N6		.77 mm	1.7 mm		e3			2.3 mm
CYBT-243053-02	Infineon Technologies	TELECOM CIRCUIT																								3
CYBLE-014008-00	Infineon Technologies	TELECOM CIRCUIT																								3
CYBLE-202007-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30	3	2 mm	15 mm					23 mm
CYW20706UA1KFFB1G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm					4.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.