Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGS12SN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.6 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel	TIN	BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
BGT24LTR11N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-PBCC-B16	1	.77 mm	2.4 mm		e3			2.4 mm
BGB741L7ESDE6327XTSA1	Infineon Technologies	TELECOM CIRCUIT																				GOLD				1				e4
BGA524N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
CYBLE-416045-02	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	43		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			.9 mm	85 Cel	-40 Cel		UNSPECIFIED	8000 Mbps	R-XXMA-N43	3	2 mm	14 mm					18.5 mm
OC2321VQFN8XTMA1	Infineon Technologies	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
CYBLE-222014-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			.762 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N22	3	1.9 mm	10 mm					10 mm
TDA5210XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
CY7B933-JXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.16 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
BGT24MTR11E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
CYBLE-212006-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30	3	2 mm	15 mm					23 mm
TDA5200XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
CYW43439KUBGT	Infineon Technologies	TELECOM CIRCUIT																								1
CYBT-343026-01	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1.22 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N24	3	1.95 mm	12 mm					15.5 mm
BGSA14GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
BGB707L7ESDE6327XTSA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q101		3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			GOLD PALLADIUM	DUAL		R-PDSO-N7	1	.5 mm	1.3 mm					2 mm
CY7B923-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
TDA7116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
CYBLE-214015-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32	3	1.8 mm	11 mm					11 mm
CY7B933-JXIT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.16 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
TDK5101FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
TDK5110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
BGM15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm					1.9 mm
CY7B923-JXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.095 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CY7B923-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYBLE-224116-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			.76 mm	105 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N32	3	1.9 mm	9.5 mm					15.4 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel	GOLD NICKEL	BOTTOM		R-XBGA-B20	3	.98 mm	2.8 mm		e4			3.2 mm
BGT24MTR12E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
TDK5100FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
CYBT-353027-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	19		SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1.05 mm	85 Cel	-30 Cel		UNSPECIFIED		S-XXMA-N19	3	1.75 mm	9 mm					9 mm
TDA5150	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.05 mm	3 mm	Not Qualified			260	3 mm
BGS12AL74E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.5 mm	1.5 mm		e4			2.3 mm
TDA5211XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
TLE8457BSJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
BGT24MR2E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
CY7B923-JXIT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.095 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
BGM15LA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm		e4			1.9 mm
BGSF110GN26E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N26	1	.77 mm	2.6 mm		e4			3.4 mm
TDA7110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
TLE8457BLEXUMA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
CY7B923-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	20	260	17.905 mm
BGM15HA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm		e4			1.9 mm
BGS12PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBCC-N10	1	.4 mm	1.1 mm					1.5 mm
TDA7200XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
BGS18GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD		S-XQMA-B14	1	.65 mm	2 mm					2 mm
BGS14PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N10	1	.4 mm	1.1 mm					1.5 mm
CY7B933-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.