Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

V23845-M4122

Infineon Technologies

SAB79C401N

Infineon Technologies

PSB4596

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Modems

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

Not Qualified

e0

9.7 mm

BGM681L11E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

11

DIE

SQUARE

UNSPECIFIED

YES

1

2.8 V

UNCASED CHIP

UPPER

S-XUUC-N11

.65 mm

2.5 mm

2.5 mm

V23826-H18-366-D3

Infineon Technologies

PEB2070A3N

Infineon Technologies

COMMERCIAL

J BEND

28

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LDCC28,.4X.6

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQCC-J28

Not Qualified

e0

V23845-M1312

Infineon Technologies

PSB4851

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3,5

SMALL OUTLINE

SOP28,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G28

2.65 mm

7.6 mm

Not Qualified

e0

18.1 mm

PSB4506

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

60 mA

3.5/9.2

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

V23845-D4511

Infineon Technologies

V23846-P4111

Infineon Technologies

PMB2245-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

V23845-D1631

Infineon Technologies

BGSF18DM20

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

20

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

3.5 V

GRID ARRAY, HEAT SINK/SLUG

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBGA-B20

3

.98 mm

2.8 mm

3.2 mm

PEB31666

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

PEB2070A3P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

IN-LINE

DIP24,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T24

Not Qualified

e0

S0280

Infineon Technologies

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

35 mA

14 V

14

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

BGB707L7ESD

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

GOLD PALLADIUM

DUAL

R-PDSO-N7

1

.5 mm

1.3 mm

Not Qualified

2 mm

PEB2023T

Infineon Technologies

TELECOM CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G14

Not Qualified

BGT24MR2

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

V23845-M1132

Infineon Technologies

BGA711N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

2 mm

PMB2200T-16

Infineon Technologies

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

48 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

Not Qualified

e0

V23845-D4122

Infineon Technologies

PEF81902F

Infineon Technologies

PEB2026T-P

Infineon Technologies

TELECOM CIRCUIT

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G20

3.5 mm

11 mm

Not Qualified

15.9 mm

V23845-D1321

Infineon Technologies

BGT24ATR12

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

V23845-M4131

Infineon Technologies

PEB22713

Infineon Technologies

TELECOM CIRCUIT

GULL WING

44

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

R-PQFP-G44

Not Qualified

BGA7L1N6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

e3

1.1 mm

BGT24MR2E6327FUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

PEF20320(176)

Infineon Technologies

PSB4506-P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

3.5/9.2

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

V23809-J307-C10

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

70 Cel

0 Cel

UNSPECIFIED

R-XXFO-X

Not Qualified

BGSX44MU18

Infineon Technologies

TELECOM CIRCUIT

V23845-D4532

Infineon Technologies

V23846-P1211

Infineon Technologies

PEB22711

Infineon Technologies

TELECOM CIRCUIT

GULL WING

44

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

R-PQFP-G44

Not Qualified

ICE5AR0680AG

Infineon Technologies

TIN

3

e3

PMB2708-F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

V23845-M1622

Infineon Technologies

BGT24AR4

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.3 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

V23826-H18-366-C3

Infineon Technologies

PSB2115F

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

BASIC

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Digital Transmission Interfaces

.5 mm

70 Cel

2.4 V

.45 V

CCITT I.430

0 Cel

TIN LEAD

QUAD

.192 Mbps

S-PQFP-G64

S/T

1.6 mm

10 mm

Not Qualified

7 Amp

e0

10 mm

V23846-P1212

Infineon Technologies

PMB27201

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

128

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G128

Not Qualified

PEB2040

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

MOS

IN-LINE

DIP40,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T40

Not Qualified

e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.