Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

V23845-D4222

Infineon Technologies

PSB21393

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

PEF82902F

Infineon Technologies

PSB7115FV2.1

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G144

1.6 mm

20 mm

Not Qualified

20 mm

PEB22812

Infineon Technologies

TELECOM CIRCUIT

GULL WING

144

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

R-PQFP-G144

Not Qualified

V23845-D1311

Infineon Technologies

TUA6100B6

Infineon Technologies

TELECOM CIRCUIT

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

-20 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

Not Qualified

9.7 mm

PEB31665V1.0

Infineon Technologies

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G44

Not Qualified

e0

PEB22811

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

R-PQFP-G64

Not Qualified

V23845-D1411

Infineon Technologies

V23845-D1131

Infineon Technologies

PEB22810

Infineon Technologies

TELECOM CIRCUIT

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G20

3.7 mm

11 mm

Not Qualified

PSB21391

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

Q67227H1015

Infineon Technologies

BGA7M1N6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

e3

1.1 mm

V23845-D4432

Infineon Technologies

V23845-M4112

Infineon Technologies

LH2559AC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

70 Cel

0 Cel

DUAL

R-PDSO-G8

Not Qualified

PSB4501-P

Infineon Technologies

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

140 mA

1.6/7.5

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

e0

V23845-D1121

Infineon Technologies

V23816-N1018-L362

Infineon Technologies

V23846-P4412

Infineon Technologies

V23845-D4531

Infineon Technologies

PEB8091F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

PMB6270

Infineon Technologies

PEF22817

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B225

1.5 mm

13 mm

Not Qualified

13 mm

V23846-P4322

Infineon Technologies

PEB80900H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

BGT24AR2E6327

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

5.5 mm

V23809-E11-C10

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

70 Cel

0 Cel

UNSPECIFIED

R-XXFO-X

Not Qualified

PEB2045A-2N

Infineon Technologies

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

Not Qualified

e0

V23845-D4631

Infineon Technologies

NWX1900P

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

3

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-30 Cel

QUAD

S-PQCC-N3

1.22 mm

3.8 mm

Not Qualified

3.8 mm

V23845-M1411

Infineon Technologies

V23845-M1231

Infineon Technologies

PMB2205T(V1.1)

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

33 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

PMB27202

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

128

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G128

Not Qualified

PSB4400P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

1.45 mA

1.6/7.5

IN-LINE

DIP18,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

e0

V23845-M4111

Infineon Technologies

V23845-D4321

Infineon Technologies

V23845-D4311

Infineon Technologies

PSB2115

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

V23845-M4332

Infineon Technologies

PSB21383HV1.3

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

3

2.45 mm

10 mm

260

10 mm

PSB4506A-T

Infineon Technologies

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

60 mA

3.5/9.2

SMALL OUTLINE

SOP28,.4

Other Telecom ICs

1.27 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

Not Qualified

e0

BGA5L1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

V23845-M1522

Infineon Technologies

PSB4505A

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

60 mA

3.5/9.2

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.