Infineon Technologies Other Function Telecom Interface ICs 1,022

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MB86977PFV-G-BND	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	208	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G208		1.7 mm	28 mm					28 mm
BCM20710A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
BCM4330GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm	6 mm					6 mm
BCM20736A0KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
BCM4330XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm	4.89 mm					5.33 mm
BCM4325GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm	5.81 mm					6.51 mm
BCM4339NKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	160	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B160		1 mm	8 mm					8 mm
CYV15G0204TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYV15G0104TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
BCM4356XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B395		.33 mm	4.87 mm					7.67 mm
BCM4319SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	138	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.225 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B138		.55 mm	4.53 mm					5.74 mm
BCM20713A1KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
CYL2T0201-AIP	Infineon Technologies
BCM4330XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
BCM4339XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
CYW89820BWMLGT	Infineon Technologies	TELECOM CIRCUIT
BCM4329HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm	5.62 mm					6.57 mm
BCM4318KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	75 Cel	0 Cel		BOTTOM	S-PBGA-B196		1.4 mm	12 mm					12 mm
BCM4318SKFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	75 Cel	0 Cel		BOTTOM	S-PBGA-B144		1.4 mm	10 mm					10 mm
CYW88335L2CUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
CYW89071A1CUBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
CP9093AT	Infineon Technologies	TELECOM CIRCUIT
BCM43907KWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B316		.33 mm	4.907 mm					5.848 mm
CG8674BA	Infineon Technologies
CYV15G0203TB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
BCM4334WKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		.33 mm	4.08 mm					4.48 mm
BCM43353LIUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
BCM4330GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B144		1 mm	6.5 mm					6.5 mm
BCM4334XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		.41 mm	4.08 mm					4.48 mm
BCM4354ZKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm	4.87 mm					7.67 mm
BCM89359KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	194	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B194		.55 mm	4.97 mm					7.44 mm
BCM20730A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
OC2322	Infineon Technologies	TELECOM CIRCUIT
BGT60E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT
TDK5110FXT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SP000524278	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDK5100PBF	Infineon Technologies	TELECOM CIRCUIT
SP000016381	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28		1.2 mm	4.4 mm		e3			9.7 mm
TDK5110F	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified				3 mm
SP000892662	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6		.77 mm	1.7 mm		e3			2.3 mm
TDK5111XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0195 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
SP000016384	Infineon Technologies	TELECOM CIRCUIT
TDK5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5100XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDK5111FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
SLB9635TT1.2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL	R-PDSO-G28		1.2 mm	4.4 mm					9.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.